Technical Reference; Layer 1 Specifications (Physical); Layer 2 Specifications (Mac/Rlc); Layer 3 Specifications (Rrc) - Huawei E173 Product Description

5.1 Layer 1 S

5.2 Layer 2 Specifications (MAC/RLC)

5.3 Layer 3 S
5.4 Layer 3 N
Issue 01 (2010-03-10)
pecifications (Physical)
Examples of Chan nel Coding and Multiplexing TR 25.944
Physical Layer–General Description TS 25.201
Physical Channels and Mapping of Transport
(FDD) TS 25.211
Multiplexing and Channel Coding (FDD) TS 25.212
Spreading and Modulation (FDD) TS 25.21
Physical Layer–Procedures (FDD) TS 25.21
Physical Layer–Measurements (FDD) TS 25.215
3GPP HSDPA overall description 25.308
3GPP UE radio access capabilities 25.306
MAC Protocol Specification TS 25.321
RLC Protocol Specification TS 25.322
pecifications (RRC)
UE Interlayer Procedures in Connected Mode TS 25.303
UE Procedures in Idle Mode TS 25.304
RRC Protocol Specification TS 25.331
AS/Core Network (MM/CM)
Architectural Requirements for Release 1999 TS 23.121
NAS Functions Related to Mobile Station (MS) in Idle M
Mobile Radio Interface Signaling Layer 3–General Aspects TS 24.007
Commercial in Confidence
HUAWEI E173 HSPA USB Stick V100R001
5

Technical Reference

3
Product Description
Channels onto Physical Channels
4
ode TS 23.122
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