Table Of Contents - Huawei E173 Product Description

Hspa usb stick
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1 Overview..........................................................................................................................6
2 Features...........................................................................................................................8
2.1 Features ........................................................................................................................................... 8
2.2 Technical Specifications ................................................................................................................... 8
2.2.1 Hardware ................................................................................................................................. 8
2.2.2 Dashboard ............................................................................................................................. 10
3 Services and Applications ...........................................................................................12
3.1 Packet Data Service....................................................................................................................... 12
3.2 SMS................................................................................................................................................ 12
4 System Architecture .....................................................................................................13
4.1 System Architecture ....................................................................................................................... 13
4.2 Functional Modules ........................................................................................................................ 14
5 Technical Reference .....................................................................................................16
5.1 Layer 1 Specifications (Physical) ................................................................................................... 16
5.2 Layer 2 Specifications (MAC/RLC)................................................................................................. 16
5.3 Layer 3 Specifications (RRC) ......................................................................................................... 16
5.4 Layer 3 NAS/Core Network (MM/CM)............................................................................................ 16
5.5 GSM Protocol Specifications.......................................................................................................... 17
5.6 GPRS Protocol Specifications........................................................................................................ 17
5.7 General Specifications ................................................................................................................... 17
5.8 Performance/Test Specifications .................................................................................................... 18
5.9 SIM Specifications .......................................................................................................................... 18
6 Packing List...................................................................................................................19
A Acronyms and Abbreviations......................................................................................20
Issue 01 (2010-03-10)
Commercial in Confidence
HUAWEI E173 HSPA USB Stick V100R001
Product Description
Contents
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