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LG KE820 Service Manual

LG KE820 Service Manual

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Service Manual
KE820
Date: August, 2006 / Issue 1.0

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Summary of Contents for LG KE820

  • Page 1 Service Manual KE820 Date: August, 2006 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the KE820/KG99. - 3 -...
  • Page 3 - 4 -...

  • Page 4: Table Of Contents

    2.2 Technical specification......12 5.7 Microphone trouble ........88 5.8 Vibrator trouble ........90 3. TECHNICAL BRIEF ......19 5.9 Keypad back light trouble.......92 3.1 KE820 / KG99 Component 5.10 SIM card trouble........94 Block diagram........19 5.11 MicroSD trouble ........96 3.2 Baseband Processor (BBP) 5.12 RF PART TROUBLESHOOTING ..98...
  • Page 5 - 6 -...

  • Page 6: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the KE820/KG99 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
  • Page 7 1. INTRODUCTION E. Notice of Radiated Emissions The KE820/KG99 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

  • Page 8: Abbreviation

    1. INTRODUCTION 1.3 ABBREVIATION For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Cigar Lighter Adapter Digital to Analog Converter Digital Communication System dB relative to 1 milli-watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory...
  • Page 9 1. INTRODUCTION Light Emitting Diode LG Electronics OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock...

  • Page 10: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Standard Battery Li-ion, 750mAh AVG TCVR Current 270mA typ @PL5 Standby Current 2.5 mA typ @PP9 Talk time 3 hours (GSM TX Level 7) Standby time 300 hours (Paging Period:9, RSSI: -85dBm) Charging time Under 3 hours -105dBm↓, DCS/PCS : -105dBm ↓...

  • Page 11: Technical Specification

    2. PERFORMANCE 2.2 Technical specification Item Description Specification GSM900 TX: 890 + 0.2 x n MHz RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 ) EGSM Frequency Band TX: 890 + 0.2 x (n-1024) MHz RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 ) DCS1800 TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
  • Page 12 2. PERFORMANCE Item Description Specification GSM900/EGSM Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Output RF Spectrum 6,000 (due to modulation) DCS1800/PCS1900 Offset from Carrier (kHz). Max. dBc +0.5 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000...
  • Page 13 2. PERFORMANCE Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz). Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status EGSM BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS1800/PCS1900 BER (Class II) < 2.439% @-100dBm Rx Level Report accuracy 3 dB 8 3 dB...
  • Page 14 2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% <Change> System frequency 2.5ppm (26 MHz) tolerance <Change>32.768KHz tolerance...
  • Page 15 2. PERFORMANCE Item Description Specification Battery Bar Number Voltage( 0.05V) 3.86V~4.2V Battery Indicator 3.75V~3.85V 3.75V~3.69V 3.69V~3.62V 3.62V~ 3.62V↓ 0.05V (Call) Low Voltage Warning 3.50V↓ 0.05V (Standby) Forced shut down Voltage 3.35 0.05 V Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 750mAh...
  • Page 16 2. PERFORMANCE * EDGE RF Specification (Option: KG99 is not serviced for ”EDGE mode”) Item Description Specification RMS EVM Peak EVM Percentile EVM ≥ Origin Offset Suppression 30dB GSM900/EGSM Level Power Toler. Level Power Toler. 27dBm 17dBm 27dBm 15dBm 27dBm 13dBm 27dBm 11dBm...
  • Page 17 2. PERFORMANCE Item Description Specification Output RF Spectrum DCS1800, PCS1900 (due to modulation) Offset from carrier(kHz) Max. dBc +0.5 600~<1,200 1,200~<1,800 1,800~<3,000 3,000~<6,000 6,000 Output RF Spectrum GSM900/EGSM (due to switching transient) Offset from carrier(kHz) Max. dBm 1,200 1,800 --30 DCS1800, PCS1900 Offset from carrier(kHz) Max.

  • Page 18: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF Baseband circuit 3.1 KE820 / KG99 Component Block diagram. Figure 1 KE820/KG99 Hardware architecture KE820/KG99 is composed with 3 different PCB part such as main PCB, sub PCB and FPCB. - 19 -...
  • Page 19 3. TECHNICAL BRIEF The functional component arrangement is mentioned below diagram. Figure 2 KE820/KG99 Functional block diagram - 20 -...

  • Page 20: Baseband Processor (Bbp) Introduction

    3. TECHNICAL BRIEF 3.2 Baseband Processor (BBP) Introduction Figure 3. Top level block diagram of the S-GOLD2 (PMB8876) 3.2.1 General Description S-GOLD2 is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD2 Provides multimedia extensions such as camera, software MIDI, MP3 sound.

  • Page 21: General Description

    3. TECHNICAL BRIEF 3.2.2 General Description • Processing core ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the Jazelle Java extension for Java acceleration. - TEAKLite DSP core • ARM-Memory - 32k Byte Boot ROM on the AHB - 96k Byte SRAM on the AHB, flexibly usable as program or data RAM - 16k Byte Cache for Program (internal) - 8k Byte tightly coupled memory for Program(internal)
  • Page 22 3. TECHNICAL BRIEF - Advanced static and dynamic power management features including TDMA-Frame synchronous low power mode and enhanced CPU modes(idle and sleep modes) - Pulse Number Modulation output for Automatic Frequency Correction(AFC) - Serial RF Control interface: support of direct conversion RF - A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission - 1 Serial Synchronous SPI compatible interfaces in the controller domain...
  • Page 23 3. TECHNICAL BRIEF 3.2.5. USART Interface KE820/KG99 have two UART Drivers as follow : - USART1 : Hardware Flow Control / SW upgrade / Calibration - USART2 : SW debug trace. Table 3 USART Interface Spec. USART_0(USART1) Resource Name Remark...
  • Page 24 3. TECHNICAL BRIEF 3.2.7. GPIO map Over a hundred allowable resources, KE820/KG99 is using as follows except dedicated to SIM and Memory. KE820/KG99 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table. Table 5 S-Gold2 GPIO pin Map...
  • Page 25 3. TECHNICAL BRIEF MEMORY &CLK GPIO_20 F_DPD For INTEL Memory CLK32K CLK32K For FM Radio & BLUETOOTH GPIO_22 Not Use CAMERA I/F CIF_D0 CIF_D(0) Camera DATA[0] CIF_D1 CIF_D(1) Camera DATA[1] CIF_D2 CIF_D(2) Camera DATA[2] CIF_D3 CIF_D(3) Camera DATA[3] CIF_D4 CIF_D(4) Camera DATA[4] CIF_D5 CIF_D(5)
  • Page 26 3. TECHNICAL BRIEF GPIO_99 CHG_LED_CTRL Charging indicator LED control GPIO_100 TF_PWR_EN TransFlash card power enable(active High) DIF_RESET1_GPIO DIF_RESET1 LCD Reset EINT6 REMOTE_INT For Remote Control Headset I2C_SCL For SM-Power, FM Radio, Audio AMP I2C_SDA " PM_INT (EINT) PM_INT SM-Power interrupt SIM CARD CC_IO SIM_IO SIM CARD I/O...
  • Page 27 3. TECHNICAL BRIEF I2S1_RX I2S1_RX For Bluetooth I2S1_TX I2S1_TX " I2S1_WA0 I2S1_WA0 " MMCI_DAT[1] TF_DAT1 For T-Flash MMCI_DAT[2] TF_DAT2 " MMCI_DAT[3] TF_DAT3 " AUDIO I/F EPN1 RCV_N For Receiver EPP1 RCV_P " EPPA1 BBP_SND_L For Speaker EPPA2 BBP_SND_R For Speaker MICN1 MIC1_N For Mic...
  • Page 28 3. TECHNICAL BRIEF TRIG_IN TRIG_IN " MON1 MON1 " MON2 MON2 " TRACESYNC TRACESYNC " TRACECLK TRACECLK " PIPESTAT[2] PIPESTAT[2] " PIPESTAT[1] PIPESTAT[1] " PIPESTAT[0] PIPESTAT[0] " TRACEPKT[0] TRACEPKT[0] " TRACEPKT[1] TRACEPKT[1] " TRACEPKT[2] TRACEPKT[2] " TRACEPKT[3] TRACEPKT[3] " TRACEPKT[4] TRACEPKT[4] "...
  • Page 29 3. TECHNICAL BRIEF EBU_RD_n Read strobe EBU_BC0_n _BC0 EBU_BC1_n _BC1 EBU_A[0] A(0) Address bus[0] EBU_A[1] A(1) Address bus[1] EBU_A[2] A(2) Address bus[2] EBU_A[3] A(3) Address bus[3] EBU_A[4] A(4) Address bus[4] EBU_A[5] A(5) Address bus[5] EBU_A[6] A(6) Address bus[6] EBU_A[7] A(7) Address bus[7] EBU_A[8] A(8)
  • Page 30 3. TECHNICAL BRIEF EBU_WAIT_n _WAIT EBU_SDCLKO SDCLKO EBU_SDCLKI SDCLKI EBU_BFCLKO BFCLKO EBU_BFCLKI BFCLKI EBU_CKE SSC1_SCLK F_DPD T_OUT0 TXON_PA RF Power amp turn on GPIO_44 VIBRATOR_EN Vibrator enable(High: enable, Low:disable) T_OUT2 PA_BAND RF band select T_OUT3 ANT_SW1 RF FEM control signal 1 T_OUT4 ANT_SW2 RF FEM control signal 2...
  • Page 31 3. TECHNICAL BRIEF F32K Sleep crystal 32.768KHz OSC32K Sleep crystal 32.768KHz RESET_n _RESET Baseband processor reset CC1CC1IO TRIG_OUT For JTAG & ETM Interface Wake up signal to alarm (High; RTC_OUT RTC_OUT wake up, Low: Power off) VCXO_EN VCXO_EN 26MHz clock enable DSPIN0 _BT_RESET Bluetooth chip reset...

  • Page 32: Power Management Ic

    3. TECHNICAL BRIEF 3.3 Power management IC 3.3.1. General Description SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold2. Although optimized for usage with the Infineon S- GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well.
  • Page 33 3. TECHNICAL BRIEF Figure 4 Top level block diagram of the SM-Power(PMB6812) SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality. SM-POWER features a baseband supply concept with a DC/DC step-down converter (SDBB) cascaded by two linear regulators (LBB1/2) - SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g.
  • Page 34 3. TECHNICAL BRIEF SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator LBB1 for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being supplied by the other linear regulator LBB2.
  • Page 35 3V3_AUDIO 1V8_MEM I2C BUS INTERFACE PMB8753 2V65_BT RF Transceiver PWRON 1V5_CORE PMB6272 Charge VBAT CONTROL _RESET 1V8_MEM Control 2V85_RF PM_INT 2V72_IO 1V5_RF 2V7_VCXO Audio LED/3 RF3158 1V5_CORE VSUPPLY VSUPPLY Figure 5 Power domain block diagram of KE820/KG99 - 36 -...
  • Page 36 3. TECHNICAL BRIEF VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT R202 R203 RTC_OUT PWRON VBACKUP 220K R208 470K SPOWER_INT VCH_CTL C207 C208 C209 C210 C211 C212 C213 _PMRST VBAT 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 1V8_MEM 3V1_USB 1V5_RF VBAT 2V65_ANA VBAT...
  • Page 37 3. TECHNICAL BRIEF 3.3.2. Charging SM-POWER provides together with an external p-channel FET Siliconix Si3455 an external AC- adapter a complete charge control function for charging of Li-Ion or Li-Ion-Polymer batteries. Either a 1-cell Li-Ion or Li-Ion-Polymer battery with 4.1, 4.2 or 4.4 Volts may be used. 4.2V~3.85V 3.85V~3.75V 3.75V~3.69V...

  • Page 38: Power On/Off

    To support Remote power on function for factory mass production, applied an analog switch as following figure. As monitoring the RPWRON(GPIO_110) and Key matrix KP_OUT(1) & KP_IN(5), KE820/KG99 system recognize whether remote power on or End-key pushed - 39 -...

  • Page 39: Sim Interface

    Figure9 Remote power on and End-key power on circuit 3.5. SIM interface KE820/KG99 supports 1.8V & 3V plug in SIM, SIM interface scheme is shown in (Figure 10). SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold2) and the SIM power supply enabled by BBP (_SIM_EN).

  • Page 40: Memory

    3. TECHNICAL BRIEF 3.6. Memory 256Mbit Flash & 128Mbit SDRAM employed on KE820/KG99 with 16 bit parallel data bus thru ADD(0)~ ADD(24). The 256Mbit Sibley Wireless Flash memory with LPSDRAM stacked device family offers multiple high-performance solutions. The Sibley flash die is manufactured on 90 nm process technology.

  • Page 41: Lcd Display

    3. TECHNICAL BRIEF 3.7. LCD Display LCD module include: - LCD : 220 x 176 265K Colors TFT LCD - Backlight : 4 piece of white LED illumination LCD module is connected to main board thru 30 pins connector. LCD FPC Interface Spec: Table 7 LCD FPC Interface Spec.

  • Page 42: Keypad Switching & Scanning

    3. TECHNICAL BRIEF 3.8. Keypad Switching & Scanning The keypad interface is a peripheral which can be used for scanning keypads up to 8 rows (outputs from Port Control Logic) and 8 columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.

  • Page 43: Keypad Back-Light Illumination

    There are 7 snow white color LEDs on the sub PCB for keypad illumination. Keypad Back-light is controlled by SM-Power LED port which has constant current control function. The whole configuration of the SM-POWER LED drivers is shown in below Figure16. ( SLED1, SLED2 port are not used in the KE820.KG99) - 44 -...
  • Page 44 3. TECHNICAL BRIEF Figure 15 Keypad Back-light LEDs VBAT LD108 LD107 LD106 LD105 LD103 LD102 LD101 R181 KEY_BACKLIGHT Figure 16 Keypad Back-light LEDs - 45 -...

  • Page 45: Lcd Back Light Illumination

    3. TECHNICAL BRIEF 3.10. LCD back light illumination Employed the AAT2805 is a dual charge pump designed to support both the white LED backlight and flash applications for systems operating with lithium-ion/polymer batteries. The backlight charge pump is capable of driving up to four LEDs at a total of 80mA. The current sinks may be operated individually or in parallel for driving higher current LEDs.
  • Page 46 3. TECHNICAL BRIEF Figure 18 EN/SET port control method - 47 -...

  • Page 47: Battery Current Consumption Monitor

    3. TECHNICAL BRIEF 3.11 Battery current consumption monitor KE820/KG99 use a current monitoring function to calculate the battery capacity and the remaining time, as monitoring current flow from the battery thru 47mohm resistor. VSUPPLY VBAT U201 R204 LOAD CN201 47mohm...

  • Page 48: Audio

    3. TECHNICAL BRIEF In case of KE820/KG99 mass production, the JTAG & ETM interface connector will not be mount on board. That is only for developing and software debugging purpose.( It will not be mounted on mass production PCB) 3.13. Audio KE820/KG99 Audio signal flow diagram as following diagram.
  • Page 49 3. TECHNICAL BRIEF 3.13.1. Audio amplifier sub system IC with 3D effect Audio amplifier sub system IC is an audio power amplifier capable of delivering 500mW of continuous average power into a mono 8Ω load, 25mW per channel of continuous average power into stereo 32Ω...

  • Page 50: Multi Port Switch

    3. TECHNICAL BRIEF 3.13.2. Microphone with gain switching circuit As controlling the MIC_GAIN_SEL, Microphone sensitivity can be selected both -42dB (MIC_GAIN_SEL set low) and -30dB(MIC_GAIN_SEL set high) L104 C114 MIC1_P 0.1u 100nH C115 MIC100 100p L105 C116 MIC1_N 0.1u 100nH R120 VMICP R122...
  • Page 51 3. TECHNICAL BRIEF 2V72_IO VBAT VBAT R224 R228 Pin6 TXD_0 Pin7 RXD_0 U209 DG2018DN Pin7 COM4 MULTI_PORT_1 R451 JACK_DETECT IN1_2 IN3_4 COM2 Pin7 Pin6 Q202 REMOTE_INT R231 Pin7 REMOTE_ADC MULTI_PORT_0 VBUS_USB C246 R233 C456 C458 C459 RN1307 100p 0.1u R234 1.5K USB_PU R235...

  • Page 52: Usb Charging Circuit

    3. TECHNICAL BRIEF 3.15. USB charging circuit The USB charging circuit is a fully integrated USB VBUS voltage single-cell Li-ion battery charger circuit. The charger uses a CC/CV charge profile required by Li-ion batteries. CC charging current and End of charging current is programmable I &...

  • Page 53: Fm Radio With Rds Function

    3. TECHNICAL BRIEF 3.16 FM radio with RDS function The FM receiver uses a digital low-IF architecture which allows for the elimination of external components and factory adjustments. The receive (RX) section integrates a low noise amplifier (LNA) supporting the worldwide FM broadcast band (87.5 to 108 MHz). An automatic gain control (AGC) circuit controls the gain of the LNA to optimize sensitivity and rejection of strong interferers.

  • Page 54: Bluetooth

    3. TECHNICAL BRIEF 3.17. BLUETOOTH Figure 29 BLUETOOTH Functional block diagram. 3.17.1. General Features • Single Chip Bluetooth device for cellular applications integrating radio, baseband and memory • Fabricated in advanced low power 0.13µm CMOS technology • Very low component count (6 external components) •...
  • Page 55 3. TECHNICAL BRIEF • Autonomous power down scenarios of Bluetooth and cellular system supported • Packages: - P-VQFN-48 package - P-WFLGA-56 package • Temperature range from -40°C up to 85°C • Boundary scan for interface lines via JTAG 3.17.2 Micro-Controller-Section •...
  • Page 56 HCI Three-Wire UART transport layer two interface lines (UARTTXD and UARTRXD) are needed. The hardware flow control lines (UARTRTS and UARTCTS) are supported but the use is optional. In KE820/KG99 used three-wire UART communication. The UART interface has its own supply voltage (VDDUART) to ensure compatibility with the I/O voltages used by the S-Gold2.

  • Page 57: Micro Sd External Memory Card Slot

    3. TECHNICAL BRIEF 2V72_IO 1V8_MEM BLUETOOTH C100 C101 0.1u 0.1u SCL0_P0_13 2V65_BT 1V5_CORE 1V8_MEM VBALUN PCMFR2_SDA0_P0_12 TP105 BT_VCXO_EN SLEEPX_P0_15 CLK32_P1_5 CLK32K TRST_ RTCK WAKEUP_HOST_P1_8 JTAG_ WAKEUP_BT_P1_7 TP111 RESET_ _BT_RESET VDDSUP U102 RFOUT VDDCREG PMB8753 VDD_1 PAON VDD_2 PSEL0 VDDC1 PSEL1 VDDC2 VDDPMREG TX_CONF_RXON...
  • Page 58 3. TECHNICAL BRIEF Table 9 Micro SD memory pad assign. SD mode Pin No. Name Type Description DAT2 Data bit [2] CD/DAT3 Data bit [3] Command response Power Power supply Clock Ground Power ground DAT0 Data bit [0] DAT1 Data bit [1] Figure 33 Micro SD memory card detection scheme Table 10 Micro SD memory card detect truth table.

  • Page 59: 18Pin Multi Media Interface Connector

    DUMMY1 DUMMY2 1000p Figure 34 Micro SD socket circuit with power control 3.19. 18pin Multi Media Interface connector Table 11 Multi media interface pin assign KE820/KG99 MMI Pin Function Description FM_ANT FM radio antenna / Audio ground HS_MIC Headset microphone signal...
  • Page 60 3. TECHNICAL BRIEF 2V85_IO2 VBUS_USB 2V72_IO 2V85_IO2 VCHG VBAT R102 U100 LMV7291MGX-NOPB 2V65_ANA VIN- R103 HOOK_DETECT VIN+ C102 CN100 R110 R109 100p L112 100nH 220K 1.5K C151 C104 0.1u R111 2.2K MIC2_N L109 100nH C105 0.1u MIC2_P L100 100nH C163 JACK_TYPE MULTI_PORT_2 C110...

  • Page 61: General Description

    3. TECHNICAL BRIEF RF circuit Figure 36 RF Block Diagram 3.20. General Description The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. The transceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality.

  • Page 62: Receiver Part

    3. TECHNICAL BRIEF GSM850 GSM900 DCS1800 PCS1900 2V85_RF C445 C446 C443 C444 C441 C442 C439 C440 1.8p 1.8p 1.8p 1.8p 1.8p 1.8p 1.8p 1.8p C416 0.1u L404 L405 L402 L403 18nH 18nH 5.6nH 5.6nH 2V85_RF 1V5_RF 1V5_RF 2V85_RF 2V7_VCXO R448 C417 C457 4.7u...

  • Page 63: Transmitter Part

    3. TECHNICAL BRIEF The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
  • Page 64 3. TECHNICAL BRIEF Figure 39 Transmitter part block diagram control pin VBIAS for efficiency enhancement. In GMSK mode, the PA is in saturated high efficiency mode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- / down-ramping and output power level are set.

  • Page 65: Rf Synthesizer

    3. TECHNICAL BRIEF 3.23. RF synthesizer The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma- Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided by the internal crystal oscillator.

  • Page 66: Front End Module Control

    3. TECHNICAL BRIEF 3.25. Front End Module control Implemented in the S-Gold2 (U102) are three outputs which are ANT_SW1, ANT_SW2 and ANT_SW3 for direct control of front end modules with three logic input pins to select RX and TX mode as well as low and high band operation.

  • Page 67: Dual Mode Operation

    3. TECHNICAL BRIEF Function Description HB_RFIN RF input to the High-band PA BAND_SEL Logic low=low band, Logic high=high band select TX_EN PA Enable VBATT Main supply VMODE Logic low=GMSK mode, Logic high=8PSK mode select VRAMP Ramped burst pin LB_RFIN RF input to the Low-band PA 8,9,10,11 Ground LB_RFOUT...

  • Page 68: Pcb Layout

    4. PCB layout 4. PCB layout 4.1 Main & Sub PCB component placement Figure 43 Main PCB top Figure 44 Main PCB top placement - 69 -...
  • Page 69 4. PCB layout Figure 45 Main PCB bottom Figure 46 Main PCB bottom placement - 70 -...
  • Page 70 4. PCB layout Figure 47 Sub PCB top Figure 48 Sub PCB top placement - 71 -...
  • Page 71 4. PCB layout Figure 49 Sub PCB bottom Figure 50 Sub PCB bottom placement - 72 -...
  • Page 72 4. PCB layout Battery contact Charging block 80pin socket PMIC Jog key Sleep crystal Power inductor Memor y Mobile SW Power on block Antenna feeding LCD connector SIM socket FPCB connector Audio Amp RF PAM 26MHz Main clock LCD backlight RF transceiver ETM JTAG I/F - 73 -...
  • Page 73 4. PCB layout Key light LED Mic. hole 80pin plug FM Radio 18pin MMI Bluetooth Micro SD socket USB charging IC Microphone BT antenna - 74 -...
  • Page 74 4. PCB layout Flash LED Speaker contact Camera connector Vibrator contact Volume up End / Power on Volume down AF trig / Shutter 50pin Main I/F PRWRON USART TP TXD CTS - 75 -...

  • Page 75: Trouble Shooting

    5. Trouble shooting 5. Trouble shooting 5.1 Trouble shooting test setup 4.000V 0.0000A Figure 51 Equipment setup Power on all of test equipment - Connect PIF-UNION JIG or dummy battery to the DUT for power up. - Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.
  • Page 76 5. Trouble shooting VBAT R215 U204 NLAST4599DFT2G 6 NO PWRON END_KEY C233 RPWRON C438 R219 1000p 100K VSUPPLY U403 R1114D281D-TR-F R454 VOUT RPWRON GND1 RPWRON_EN GND2 R453 C461 C460 100K 100p 1000p VBAT KP_OUT(1) R321 2SC5585 END_KEY Q302 END_KEY R322 KP_IN(5) 100K End key...
  • Page 77 5. Trouble shooting VCHG 2V11_RTC 1V5_CORE 1V5_DSP 2V85_RF VBAT 2V7_VCXO 2V65_BT R202 R203 RTC_OUT PWRON VBACKUP 220K R208 470K SPOWER_INT VCH_CTL C207 C208 C209 C210 C211 C212 C213 _PMRST VBAT 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 2.2u 1V8_MEM 3V1_USB 1V5_RF VBAT 2V65_ANA VBAT...
  • Page 78 5. Trouble shooting START Connect power supply to the Check the "PWRON" RPWRON, signal replace U204 Check solder "_RESET" U206 or replace it signal Check solder Check the all U203 or replace it LDO's output Check solder Is the 26MHz X401, U402 clock From or replace it...

  • Page 79: Charging Trouble

    5. Trouble shooting 5.3 Charging trouble Check Points -Connection of TA (check TA voltage 4.8V) -Charging Current Path component voltage drop -Battery voltage • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : about 4.0V •...
  • Page 80 5. Trouble shooting START 18pin Resolder the MMI(CN100) CN100 The TA can be Source pin broken of Q201= Change other TA Check solder Drain pin Q201 or replace it of Q201 = D201 voltage Replace it drop Waiting until Battery voltage battery is over 3.4V? Voltage goes up...

  • Page 81: Lcd Display Trouble

    5. Trouble shooting 5.4 LCD display trouble Check Points -LCD assembly status ( FPCB) -EMI filter soldering -Connector combination 2V72_IO 2V72_IO R315 100K R317 DIF_RESET CN303 DIF_D(0:7) FL305 ICVE10184E150R101FR FL306 ICVE10184E150R101FR DIF_D(0) DIF_WR INOUT_A1 INOUT_B1 INOUT_A1 INOUT_B1 DIF_D(1) DIF_CD INOUT_A2 INOUT_B2 INOUT_A2 INOUT_B2...

  • Page 82: Camera Trouble

    5. Trouble shooting START Check LCD connector combination then LCD test with New LCD Replace LCD Is LCD FPCB module normal? Check solder and Signal is repair normal on Damaged filter Assemble 5.5 Camera Trouble Check Points -Connectors combination -EMI filter soldering -FPCB status 2V85_IO2 2V8_AF...
  • Page 83 5. Trouble shooting Camera connect Check the connector combination Check signal flow via EMI filter 50pin main PCB connector - 84 -...
  • Page 84 5. Trouble shooting START Check camera connector, 50pin main PCB connector combination then Camera test FL301, FL302, Resolder FL303, Replace Replace New Replace New Main PCB Camera FPCB module Replace Camera module Replace FPCB module Assemble Assemble - 85 -...

  • Page 85: Receiver & Speaker Trouble

    5. Trouble shooting 5.6 Receiver & Speaker trouble Check Points -Speaker spring contact -Audio amp soldering -analog switch soldering 3V3_AUDIO 2V72_IO 3V3_AUDIO U208 NLAS5223BMNR2G SPK_P C238 SPK_N COM2 SPK_RCV_P C236 C237 0.1u 4.7u SPK_RCV_N COM1 SPK_RCV_SEL RCV_P RCV_N C242 C240 C244 C243 C241...
  • Page 86 5. Trouble shooting START Check Speaker tension and Contacts are clear. R300,R301 Resolder or have low Replace LCD resistance? module Between R300, Replace FPCB R301 then retest resistance OK? Resolder or U208 is working Replace it properly? Replace Main PCB Assemble - 87 -...

  • Page 87: Microphone Trouble

    5. Trouble shooting 5.7 Microphone trouble Check Points -Microphone hole -Mic. Bias & signal come from L104 C114 MIC1_P 0.1u 100nH C115 MIC100 100p L105 C116 MIC1_N 0.1u 100nH R120 VMICP R122 C117 SP0102BE3 VMICN VA100 VA101 VA102 100p C125 C126 C127 C128...
  • Page 88 5. Trouble shooting START Check microphone sound hole Check mic. Bias Make a phone line call then Repair the damaged 80pin connector part combination Replace Signal comes microphone out from Assemble - 89 -...

  • Page 89: Vibrator Trouble

    5. Trouble shooting 5.8 Vibrator trouble Check Points -Vibrator contact -IC is working correct U207 SUY98005LT1G R221 VIBRATOR_EN L202 R222 MOTOR_N VOUT 100nH R223 C436 100K Check the driver Enable signal goes to high then vibration Check the contact is clear, if there is some obstacles then...
  • Page 90 5. Trouble shooting START Check Vibrator contact Check U207 or Pin1 of U207 is replace it high ? Check U207 or Pin3 of U207 is low? replace it Replace Vibrator Assemble - 91 -...

  • Page 91: Keypad Back Light Trouble

    5. Trouble shooting 5.9 Keypad back light trouble Check Points -Signal path is connected well -Control IC is working properly VBAT LD108 LD107 LD106 LD105 LD103 LD102 LD101 R181 KEY_BACKLIGHT - 92 -...
  • Page 92 5. Trouble shooting START Check All of LEDs solder Check U203's pin17 R181's voltages goes down replace it 80pin Repair the connector damaged Replace Sub PCB Assemble - 93 -...

  • Page 93: Sim Card Trouble

    5. Trouble shooting 5.10 SIM card trouble Check Points -Power control FET is working -Socket soldering -Proper SIM is used 2V85_SIM _SIM_EN SI1305-E3 Q301 J301 R320 4.7K SIM_RST SIM_IO SIM_CLK C308 C309 C310 Check soldering all pin of socket - 94 -...
  • Page 94 5. Trouble shooting START Check All of SIM card voltage KE820/KG99 support 1 8V & 3V SIM l 6 pins are Repair it soldered well? Q301 is Replace the working? damaged Assemble - 95 -...

  • Page 95: Microsd Trouble

    5. Trouble shooting 5.11 MicroSD trouble Check Points -Power control FET is working -Socket soldering -Card detect is working 2V85_CARD 2V72_IO NTJD4105CT1G R130 100K R132 2 G1 TF_PWR_EN 100K R133 R134 R135 R136 R137 S100 100K 100K 100K 100K 100K SCHA1B0102 DAT2_RSV TF_DAT2...
  • Page 96 5. Trouble shooting START Check the Card detect signal if it operate as above picture TF_DETECT pins Repair it are soldered well? Replace the Q1 is working damaged properly? part Assemble - 97 -...

  • Page 97: Rf Part Troubleshooting

    5. Trouble shooting 5.12 RF PART TROUBLESHOOTING 5.12.1 RF Components Main PCB Top Main PCB Bottom U401 X401 FL308 U402 SW401 Figure 1. RF Components Placement REFERENCE PART Description U401 PAM (Power Ampilifier Module) X401 VCTCXO (26MHz) FL308 FEM (Front End Module) U402 Transceiver SW401...

  • Page 98: Trouble Shooting Of Receiver Part

    5. Trouble shooting 5.12.2 Trouble Shooting of Receiver Part Checking Flow Checking Points START Setup Test Equipment Cell Power : -7 4dBm EGSM CH30 DCS CH699 Check point VCTCXO Figure 2. Main PCB Check point PLL Control Check point Mobile SW & Check point Figure 3.

  • Page 99: Checking Vctcxo Circuit

    5. Trouble shooting 5.12.3 Checking VCTCXO Circuit Checking Points Checking Flow Pin : 2.7V Is the waveform Replace X401 of Pin3 similar to X401 Checking U203 Is the waveform (PMIC) of Pin4 similar to VCTCXO Circuit is OK. See next page to check Pin 3: 26 MHz PLL Circuit.
  • Page 100 5. Trouble shooting 5.12.4 Checking PLL Control signals Checking Points Checking Flow R419 (RF_EN) R426 (RF_CLK) EN Signal is Check U402 OK ? DA(Data) is Check U402 U402 Normal CLK(Clock) is Check U402 Normal R427 (RF_DATA) Figure 7. Transceiver Control Signal is OK. See next page to check Mobile SW &...
  • Page 101 5. Trouble shooting 5.12.5 Checking Mobile SW & FEM Circuit Diagram 2V85_RF C437 0.1u SW401 KMS-506 GND11 C404 C462 GND10 R406 GND9 GND8 100p GND7 L408 2.7nH Figure 10. Mobile SW & FEM Circuit Checking Points SW40 FL30 R441 R403 R405 Figure 11 Mobile SW &...
  • Page 102 5. Trouble shooting Checking Flow Check Pin 1, 2 of SW401 with RF Cable Replace Mobile SW Signal is OK? (SW401) Check Pin 20, 21, 22 of FL308? Control Signal is Check PMB8876 (U102) Pin 16, 17 or 14, Replace FEM (FL308) Mobile SW &...
  • Page 103 5. Trouble shooting 5.12.6 Checking RX I/Q Signals Checking Flow Check RX I/Q Signals R426 RF_CLK R427 RF_DA Replace R428 Signals are Transceiver Normal ? C432 C433 PMB6272(U402) R429 R430 RX Part is OK. C434 C435 Check Base Band Circuit R431 Re Download S/W and Cal Figure 14.
  • Page 104 5. Trouble shooting 5.12.7 Trouble Shooting of Transmitter Part Checking Flow Checking Points Setup Test Equipment Cell Power : -7 4dBm EGSM CH30 DCS CH6 Check point VCTCXO Check point PLL Control Figure 17. Main PCB Top Check point TX I/Q Signal Check point Transceiver Figure 18.
  • Page 105 5. Trouble shooting 5.12.8 Checking VCTCXO Circuit See RX Part “1. Checking VCTCXO Circuit” 5.12.9 Checking PLL Control Signal See RX Part “2. Checking PLL Control Signal” - 106 -...
  • Page 106 5. Trouble shooting 5.12.10 Checking TX I/Q Signals Checking Flow Check TX I/Q Signals R426 RF_CLK R427 RF_DA Replace R428 Signals are Transceiver Normal ? C432 C433 PMB6272(U402) R429 R430 TX Part is OK. C434 C435 Check Base Band Circuit R431 Re Download S/W and Cal Figure 19.
  • Page 107 5. Trouble shooting 5.12.11 Checking Transceiver Output Signals 2V85_RF 1V5_RF C417 C457 VBIAS VDDTX1V5 VDDRX2V8 R412 LBAND_PAM_IN VDDRX1V5 U402 R413 VCO_RC HBAND_PAM_IN PMB6272 VDDTX2V8 VDDVCO2V8 R418 VDDMIX2V8 R420 R421 R415 R416 GND3 VDDXO2V8 C424 C425 FSYS1 0.1u 0.1u GND4 GND1 Figure 22.
  • Page 108 5. Trouble shooting Checking Flow Check Output Signal Replace Signals are PMB6272(U402) Normal ? Transceiver is OK. See next page to check PAM Control Circuit. LBAND_PAM_IN (MODE: GMSK) LBAND_PAM_IN (MODE: 8PSK) Figure 24. Transceiver Output (GMSK) Figure 25. Transceiver Output (8PSK) - 109 -...
  • Page 109 5. Trouble shooting 5.12.12 Checking PAM Control Signals VSUPPLY LB_RFIN LBAND_PAM_IN R407 U401 VRAMP PA_LEVEL VMODE MODE RF3158 VBATT LB_RFOUT TX_EN TXON_PA BAND_SEL PA_BAND HB_RFOUT HB_RFIN HBAND_PAM_IN C401 C402 C409 C403 100p 100p 100p 100p C408 C414 Figure 26. PAM Control Signals Circuit Checking Points MODE PA LEVEL...
  • Page 110 5. Trouble shooting Checking Flow Check Control Signals Check Signals are PMB8876(U102) Normal ? PAM Control Signal is See next page to check FEM & Mobile SW Circuit Figure 28. GSMK Control Signal Figure 29. 8PSK Control Signal - 111 -...
  • Page 111 5. Trouble shooting 5.12.13 Checking FEM & Mobile SW Circuit Diagram Mobile SW & FEM 2V85_RF C437 0.1u SW401 KMS-506 GND11 C404 C462 GND10 R406 GND9 GND8 100p GND7 L408 2.7nH Figure 30. Mobile SW & FEM Circuit Checking Points SW40 FL30 R441...
  • Page 112 5. Trouble shooting Checking Flow Check Pin 1, 2 of SW401 with RF Cable Replace Mobile SW Signal is OK? (SW401) Check Pin 20, 21, 22 of FL308? Control Signal is Check PMB8876 (U102) Pin 16, 17 or 14, Replace FEM (FL308) Mobile SW &...

  • Page 113: Download & S/W Upgrade

    6. Download & S/W upgrade 6. Download & S/W upgrade 6.1 S/W download setup 4.000V 0.0000A Figure S/W download & upgrade setup Preparation • Target terminal • PIF-Union • RS-232 Cable and PIF-UNION to Phone interface Cable • Power Supply or Battery •...

  • Page 114: Download Program User Guide

    6. Download & S/W upgrade 6.2 Download program user guide - 115 -...
  • Page 115 6. Download & S/W upgrade - 116 -...
  • Page 116 6. Download & S/W upgrade ➜ ➜ - 117 -...
  • Page 117 6. Download & S/W upgrade - 118 -...

  • Page 118: Circuit Diagram

    2V72_IO RXD_0 R136 TXD_0 UFLS R137 RPWRON_EN ON_SW ON_SW VBAT VBAT VSUPPLY Engineer: URXD LG Electronics UTXD Drawn by: T.K.CHOI RTS_0 R&D CHK: W.J.KIM TITLE: Size: KE820 CTS_0 DOC CTRL CHK: 12 1 8 A Issue 1.0 MFG ENGR CHK:...
  • Page 119 R235 Pin6 BBP_SND_R USB_DP 0.1u R238 Pin7 USB_DM 470n 220n C251 0.1u Engineer: LG Electronics Drawn by: T.K.CHOI R&D CHK: W.J.KIM TITLE: Size: KE820 DOC CTRL CHK: 12 1 8 A Issue 1.0 MFG ENGR CHK: Changed by: Date Changed:...
  • Page 120 2SC5585 VOUT MOTOR_N END_KEY 100nH R223 Q302 R322 C436 100K 100K KP_IN(5) Engineer: LG Electronics Drawn by: T.K.CHOI R&D CHK: W.J.KIM TITLE: Size: KE820 DOC CTRL CHK: 12 1 8 A Issue 1.0 MFG ENGR CHK: Changed by: Date Changed:...
  • Page 121 R426 RF_CLK R427 RF_DA R428 C432 C433 R429 R430 C434 C435 R431 Engineer: LG Electronics Drawn by: R&D CHK: W.J.KIM TITLE: Size: SON80 CARD DOC CTRL CHK: 12 1 8 A Issue 1.0 MFG ENGR CHK: Changed by: Date Changed:...
  • Page 122 C157 100p 0.1u STAR SHARP SEND KP_IN(4) R149 0.1u KP_OUT(0:3) 2V72_IO KP_OUT(0) R151 Engineer: KP_OUT(1) R152 U107 TC7SH04FS LG Electronics Drawn by: T.K.CHOI KP_OUT(2) R153 C153 0.1u C154 0.1u CLK32K R&D CHK: W.J.KIM TITLE: Size: KP_OUT(3) R154 KE820 C155 R182...
  • Page 123 1.5phi, 3mm pitch, Non OSP, Gold plating, Need text seal LD400 MOTOR_N V_DOWN KP_IN(3) KP_IN(4) shutter KP_IN(5) KP_OUT(3:4) KP_OUT(3) KP_OUT(4) Engineer: LG Electronics Drawn by: T.K.CHOI R&D CHK: W.J.KIM TITLE: Size: KE820 DOC CTRL CHK: 12 1 8 A Rev.G MFG ENGR CHK:...

  • Page 124: Pcb Layout

    8. PCB LAYOUT - 125 -...
  • Page 125 8. PCB LAYOUT - 126 -...
  • Page 126 8. PCB LAYOUT - 127 -...
  • Page 127 8. PCB LAYOUT - 128 -...

  • Page 128: Rf Calibration

    9. RF Calibration 9. RF Calibration 9.1 Test Equipment Setup 4.00 V 0.000 A 9.2 Calibration Steps 9.2.1. Turn on the Phone. 9.2.2. Execute “HK_24.exe” - 129 -...
  • Page 129 9. RF Calibration 9.2.3. Click “SETTING” Menu 9.2.4. Setup “Ezlooks” menu such as the following figure - 130 -...
  • Page 130 9. RF Calibration 9.2.5. Setup “Line System” menu such as the following figure Adiust the number times. 9.2.6.Setup Logic operation such as the following figure. Operation Mode 1. By-Pass: not control by GPIB 2. Normal: control by GPIB Setup UART Port PWR: Power Supply CELL: Call-Test Equipment - 131 -...
  • Page 131 9. RF Calibration 9.2.7. Select “MODEL”. 9.2.8. Click “START” for RF calibration 9.2.9. RF Calibration finishes. - 132 -...
  • Page 132 9. RF Calibration 9.2.10. Calibration data will be saved to the following folder. Saving format: year/month/day_PASS - 133 -...
  • Page 133 9. RF Calibration Notices: 1. The state of Phone is “ test mode “ during the CALIBRATION. 2. Calibration program automatically changes either “normal mode” or “ptest mode”. 3. RF Calibration steps as follow: TX Channel compensation: EGSM->DCS->PCS->EDGE EGSM->EDGE DCS->EDGE PCS RX Channel compensation: EGSM->DCS->PCS 4.

  • Page 134: Engineering Mode

    10. ENGINEERING MODE 10. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*#”Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’...

  • Page 135: Standalone Test

    11. STANDALONE TEST 11. STANDALONE TEST 11.1 Test Program Setting 1 Set COM Port. 2 Check PC Baud rate. 3 Confirm EEPROM & Delta file prefix name. - 136 -...
  • Page 136 11. STANDALONE TEST 4 Click “Update Info” for communicating Phone and Test -Program. Connected - 137 -...
  • Page 137 11. STANDALONE TEST 5 For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar. 6 Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished. Change "ptest mood" - 138 -...

  • Page 138: Tx Test

    11. STANDALONE TEST 11.2 Tx Test 1 Click “Non signaling mode” bar and then confirm “OK” text in the command line. 2 Put the number of TX Channel in the ARFCN. 3 Select “Tx” in the RF mode menu and “PCL” in the PA Level menu. 4 Finally, Click “...

  • Page 139: Rx Test

    11. STANDALONE TEST 11.3 Rx Test 1 Put the number of RX Channel in the ARFCN. 2 Sele ct “Rx” in the RF mode menu. 3 Finally, Click “ Write All” bar and try the efficiency test of Phone. 4 The Phone must be changed “normal mode” after finishing Test. 5 Change the Phone to “normal mode”...

  • Page 140: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW - 141 -...
  • Page 141 - 142 -...

  • Page 142: Replacement Parts

    AWAZ00 WINDOW ASSY AWAZ0008301 Black BFAA00 FILM,INMOLD BFAA0041301 MAIN WINDOW IN-MOLD FILM MWAC00 WINDOW,LCD MWAC0071101 KE820(IML) Black MBFF00 BRACKET,LCD MBFF0010601 MOLD, PC LUPOY GP-2100, , , , , MCJK00 COVER,FRONT MCJK0056901 MOLD, PC LUPOY SC-1004A, , , , , Black...
  • Page 143 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MCCZ02 MCCZ0021401 MOLD, Urethane Rubber S190A, , , , , Black MTAZ00 TAPE MTAZ0147201 COMPLEX, (empty), , , , , Transparent MFEZ00 FRAME MFEZ0010001 MOLD, PC LUPOY SC-1004A, , , , , Black MPBJ00 TAPE...
  • Page 144 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MDAG00 DECO ASSY ADBY0010601 KE820 Front Deco Black BFAA00 FILM,INMOLD BFAA0041401 DECO FRONT IN-MOLD FILM MDAG00 DECO,FRONT MDAG0018801 MLAK00 LABEL,MODEL MLAK0019102 EUROP & CIS MIDZ00...

  • Page 145: Main Component

    WHITE ,1 LED,2.0*1.5*0.45 ,R/TP ,pb-free(power LED) SWITCH,TACT ESCY0004201 12 V,0.02 A,HORIZONTAL ,0.2 G, SPCY00 PCB,FLEXIBLE SPCY0075501 POLYI , mm,MULTI-2 , SAJY00 PCB ASSY,SUB SAJY0017001 KE820 RUS, EDGE Phone, SUB PCB ADCA00 DOME ASSY,METAL ADCA0054901 SAJE00 PCB ASSY,SUB,SMT SAJE0011901 PCB ASSY,SUB,SMT SAJC00 SAJC0011001 BOTTOM...
  • Page 146 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C114 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C115 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C116 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C117 CAP,CHIP,MAKER ECZH0000813...
  • Page 147 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C162 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C163 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C164 CAP,CHIP,MAKER ECZH0000826 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C165 CAP,CHIP,MAKER ECZH0000826...
  • Page 148 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R109 RES,CHIP,MAKER ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP R110 RES,CHIP,MAKER ERHZ0000445 220 Kohm,1/16W ,J ,1005 ,R/TP R111 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP R116 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP...
  • Page 149 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R181 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP R182 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP R183 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP R184 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 150 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R163 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP R164 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP R165 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP SPJY00 PCB,SUB SPJY0027401 FR-4 , 0.8mm,BUILD-UP 8 ,...
  • Page 151 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C304 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C305 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C306 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C307 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 152 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C443 CAP,CERAMIC,CHIP ECCH0000178 1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP C444 CAP,CERAMIC,CHIP ECCH0000178 1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP C445 CAP,CERAMIC,CHIP ECCH0000178 1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP C446 CAP,CERAMIC,CHIP ECCH0000178...
  • Page 153 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L407 INDUCTOR,CHIP ELCH0001019 3.9 nH,J ,1005 ,R/TP ,Pb Free NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T, PT401 THERMISTOR SETY0006301 PBFREE Q202 TR,BJT,NPN EQBN0007001 SC-70 ,.1 W,R/TP ,Pb free SOT-323 ,.29 W,1.8 V,.86 A,R/TP ,P-Chanel MOSFET, Q301 TR,FET,P-CHANNEL...
  • Page 154 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R317 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP R320 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP R323 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP R324 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP...
  • Page 155 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog U208 EUSY0300101 Switch, PB-Free U209 EUSY0314501 QFN ,16 PIN,R/TP , Micro SMD ,25 PIN,R/TP ,Output Capacitor Audio U210 EUSY0243201 Subsystem...
  • Page 156 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C115 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C116 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C117 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C118 CAP,CERAMIC,CHIP ECCH0000155...
  • Page 157 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C222 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP C223 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP C224 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP C226 CAP,CHIP,MAKER ECZH0001421...
  • Page 158 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R124 RES,CHIP,MAKER ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP R126 RES,CHIP,MAKER ERHZ0000444 22 Kohm,1/16W ,J ,1005 ,R/TP R136 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP R137 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP...
  • Page 159 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark X101 X-TAL EXXY0018701 32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9, SPFY00 PCB,MAIN SPFY0127401 FR-4 , 0.8mm,STAGGERED-10 , WSYY00 SOFTWARE WSYY0446801 ; , , ,EUROPE , , SNGF00 ANTENNA,GSM,FIXED SNGF0018701...

  • Page 160: Accessory

    9 PIN,ETC , , mm,SD Adaptor for TFR MCEZ00 CASE MCEZ0003101 COMPLEX, (empty), , , , , MCEZ01 CASE MCEZ0001201 SD Card Case 3.7 V,730 mAh,1 CELL,PRISMATIC ,KE820 BATT(IP), SBPL00 BATTERY PACK,LI-ION SBPL0082901 Pb-Free SGDY00 DATA CABLE SGDY0010901 LG-US03K ,18pin USB DataCable...
  • Page 161 Note...
  • Page 162 Note...

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