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JVC AV-20FD24 Service Manual page 14

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AV-20FD24
4. REMOVAL AND INSTALLATION OF FLAT
PACKAGE IC
REMOVAL
1. Put the Masking Tape (cotton tape) around the Flat Package IC
to protect other parts from any damage.
(Refer to Fig. 4-1.)
NOTE
Masking is carried out on all the parts located within 10 mm
distance from IC leads.
Masking Tape
(Cotton Tape)
2. Heat the IC leads using a blower type IC desoldering machine.
(Refer to Fig. 4-2.)
NOTE
Do not add the rotating and the back and forth directions force
on the IC, until IC can move back and fortheasily after
desoldering the IC leads completely.
IC
14
IC
Fig. 4-1
Blower type IC
desoldering machine
Fig. 4-2
No. 52133
3. When IC starts moving back and forth easily after desoldering
completely, pickup the corner of the IC usinga tweezers and
remove the IC by moving with the IC desoldering machine.
(Refer to Fig. 4-3.)
NOTE
Some ICs on the PCB are affixed with glue, so be careful not
to break or damage the foil of each IC leads or solder lands
under the IC when removing it.
Tweezers
IC
4. Peel off the Masking Tape.
5. Absorb the solder left on the pattern using the Braided Shield
Wire. (Refer to Fig. 4-4.)
NOTE
Do not move the Braided Shield Wire in the vertical direction
towards the IC pattern.
Braided Shield Wire
Blower type IC
desoldering machine
Fig. 4-3
Soldering Iron
IC pattern
Fig. 4-4

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