Huawei MU509 Manual page 8

Design of Solder Mask
The PCB pad design can be solder mask defined (SMD), or non-solder mask
defined (NSMD).
NSMD is recommended. In addition, the solder mask of the NSMD pad design is
larger than the pad so the reliability of the solder joint can be improved.
The solder mask must be 100 um to150 um larger than the pad, that is, the single
side of the solder mask must be 50 um to 75 um larger than the pad. The specific
size depends on the processing capability of the PCB manufacturer.
Assembly
Stencil Design
It is recommended that the stencil for the LGA module be 0.12 mm in thickness.
For the stencil design, see the following figure:
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