Audio Interface - Huawei MU609 Hardware Manual

Hspa mini pcie module
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HUAWEI MU609 HSPA Mini PCIe Module
Hardware Guide
To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic
compatibility (EMC) authentication, the USIM socket should be placed near the
PCIe interface (it is recommended that the PCB circuit connects the PCIe interface
and the USIM socket does not exceed 100 mm), because a long circuit may lead to
wave distortion, thus affecting signal quality.
It is recommended that you wrap the area adjacent to the USIM_CLK and
USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the
Ground pin of the USIM card must be well connected to the power Ground pin
supplying power to the PCIe Adapter.
A 100 nF capacitor and1 μF capacitor are placed between the USIM_PWR and
GND pins in a parallel manner (If USIM_PWR circuit is too long, that the larger
capacitance such as 4.7 μF can be employed if necessary). Three 33 pF
capacitors are placed between the USIM_DATA and Ground pins, the
USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to
filter interference from RF signals.
It is recommended to take electrostatic discharge (ESD) protection measures near
the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance
less than 10 pF must be placed as close as possible to the USIM socket, and the
Ground pin of the ESD protection component is well connected to the power
Ground pin that supplies power to the PCIe Adapter.

3.7 Audio Interface

The MU609 module provides one PCM digital audio interface. Table 3-7 lists the
signals on the digital audio interface.
Table 3-7 Signals on the digital audio interface
Pin
Pin Name
No.
45
PCM_CLK
47
PCM_DOUT
49
PCM_DIN
51
PCM_SYNC
The MU609 module interface enables communication with an external codec to
support linear format.
Issue 03 (2014-12-04)
Pad
Description
Type
O
PCM interface clock
O
PCM I/F data out
I
PCM I/F data in
O
PCM interface sync
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
Parameter
Min.(V)
V
1.35
OH
V
0
OL
V
1.35
OH
V
0
OL
V
1.2
IH
V
–0.3
IL
V
1.35
OH
V
0
OL
Typ.(V)
Max.(V)
-
1.8
-
0.45
-
1.8
-
0.45
1.8
2.1
-
0.5
-
1.8
-
0.45
25

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