Reliability Features - Huawei MU609 Hardware Manual

HUAWEI MU609 HSPA Mini PCIe Module
Hardware Guide

5.5 Reliability Features

Table 5-9 lists the test conditions and results of the reliability of the MU609 module .
Table 5-9 Test conditions and results of the reliability of the MU609 module
Item
Stress Low-temperature
storage
High-temperature
storage
Low-temperature
operating
High-temperature
operating
Damp heat
cycling
Thermal shock
Issue 03 (2014-12-04)
Test Condition
 Temperature: –40ºC

Operation mode: no
power, no package
 Test duration: 24 h
 Temperature: 85ºC
 Operation mode: no
power, no package
 Test duration: 24 h

Temperature: –20ºC
 Operation mode:
working with service
connected
 Test duration: 24 h
 Temperature: 60ºC
 Operation mode:
working with service
connected
 Test duration: 24 h
 High temperature: 55ºC

Low temperature: 25ºC

Humidity: 95%±3%
 Operation mode:
working with service
connected
 Test duration: 6 cycles;
12 h+12 h/cycle
 Low temperature:
–40ºC

High temperature: 85ºC
 Temperature change
interval: < 20s
 Operation mode: no
power

Test duration: 100
cycles; 15 Min+15
Min/cycle
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Electrical and Reliability Features
Standard Sample size
JESD22- 3 pcs/group
A119-C
JESD22- 3 pcs/group
A103-C
IEC60068 3 pcs/group
-2-1
JESD22- 3 pcs/group
A108-C
JESD 3 pcs/group
22-A101-
B
JESD22- 3 pcs/group
A106-B
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
42