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HP ProDesk 400 G2.5 Disassembly Instructions Manual
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HP ProDesk 400 G2.5 Disassembly Instructions Manual

Sff business pc
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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 400 G2.5 SFF Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium
coin or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Power cord
Cooler fan 82g,system fan 72g,PSU fan 32.4g
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
1
1
1
186.4g
Page 1

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Summary of Contents for HP ProDesk 400 G2.5

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable)
  • Page 3 Figure1 Release Thumb screw on the access panel. Figure2 Griping the tab at the end of access panel, pull towards the rear and remove from unit. Figure3 Pull 3 pcs bezel hooks and remove the front bezel Figure4 Unplug the cooler cable from PCA from chassis.
  • Page 4 Figure7 Release the HDD screws Figure8 Remove the HDD form chassis (screw driver T15) Figure9 Push the latch and release the Slim ODD. Figure10 Remove the Slim ODD form chassis. Figure11 Unplug all cable conn. from PCA. Figure12 Release 6 pcs screws from PCA (screw driver T15) EL-MF877-00 Page 4...
  • Page 5 Figure13 Remove PCA from chassis Figure14 Push the hooks on both sides and then pick up the memory Figure15 Rotate the handle and open it up Figure16 Remove the CPU from board Figure17 Remove the battery from the PCA Figure18 Release the screw of the FIO cable (screw driver T15) EL-MF877-00 Page 5...
  • Page 6 Figure 19 Push the plastic hook and rotation the FIO Figure20 Release the SD card reader screw module inside. Remove the FIO module from chassis (screw driver T15) Figure21 Remove the SD Card reader from chassis Figure22 Release two screws of speaker Figure23 Remove the speaker form chassis Figure24 Release 2 pcs screws from system fan.
  • Page 7 Figure25 Remove the system fan from chassis Figure26 Release 4 pcs screws of PSU and remove it (screw driver T15) Figure27 Pull up the PSU and remove it Figure28 Remove screw for top cover Figure29 Remove case cover (screw driver PH2) EL-MF877-00 Page 7 Template Revision B...
  • Page 8 Figure30 Remove FG screw Figure31 Disconnect fan connector (screw driver PH2) Figure32 Disconnect the L/N wire connector Figure33 Cut the cable tie (Micro shear YN-3) Figure34 Remove PCB screw Figure35 Remove plastic cover Figure36 Remove AC inlet Figure37 Remove the FAN (screw driver PH2) EL-MF877-00 Page 8...
  • Page 9 Figure38 Cut output cable Figure39 Remove capacitors use solder iron (micro shear YN-3) Figure40 Remove of Electrolytic Capacitors greater than 2.5cm in diameter or height (C801) EL-MF877-00 Page 9 Template Revision B PSG instructions for this template are available at EL-MF877-01...