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7. Notes
1) Notes concerning receiver surface
Please note enough that it is likely to malfunction when a surface is dirty with garbage and dust, etc.
Moreover, please do not touch a surface.
2) Please take proper methods to prevent ESD. The IC built in GP2AP01VT10F is ESD-sensitive because it is fabricated by
sub-micron CMOS process. For example, in handling GP2AP01VT10F, human body and soldering iron etc. should be
grounded.
3) Before the circuit design
In circuit designing, make allowance for the degradation of the laser output that results from long continuous
operation.
4) Notes ambient light
When set to avoid malfunctions due to a strong disturbance light, such an arrangement to receive ambient light directly on the
detector, please be avoided. Also by placing this product in close to other components, it may be a malfunction with the light
reflected from their product, structural arrangement to reduce the amount of light receiving surface of the outer, please
consider.
5) After being mounted and soldered, if GP2AP01VT10F is deformed by external force or impact, e.g. something falls onto the
device, it may result in defective implementation such as lift-off of the terminals. Careful handling should be taken.
6) For soldering : Refer to Page 12.
7) Recommended external circuit
VDD
V
I2C
R
GPIO
SCL
SDA
GPIO1
GP2AP01VT10F
(Top View)
R
R
SCL
SDA
⑪ AVDD
CX2
⑩ SCL
⑨ SDA
⑧ (DNC)
⑦ GPIO1
Components
CX1
CX2
R
GPIO
R
SDA
R
SCL
R
XSHUT
⑫ (GND4)
①AVDDVCSEL
CX1
② AVSSVCSEL
Emitter
③ GND
④ (GND2)
Detector
⑤ XSHUT
⑥ (GND3)
Recommended values
4.7μF
100nF
47kΩ
10kΩ
10kΩ
47kΩ
3 / 18
V
VCSEL
R
XSHUT
XSHUT
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