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CGB)
Tubular-shaped
chip jumper
Ordinary jumper
Tubular-shaped chip
VWRASAS-—
----
VRD-MF2EE000C
Electrode
Appearance
Adhesive
Solder
Symbol
on
wiring
diagram
LJ
Table 23-1
SERVICING
OF
LEADLESS
TYPE
RESISTORS
AND
CAPACITORS
Here's
their servicing
method
different
from
that
for the
ordinary type of resistors and capacitors.
Removal of the Tubular-Shaped Chip
1. Using a soldering iron, heat the solder at each terminal of
the chip to get it absorbed
into a braided
wire applied
thereon. See Fig. 23-1.
2. Holding the chip with a pincette, take if off gently using the
soldering
iron's
heat
applied
on
each
terminal
of it. See
Fig. 23-2.
Cautions on removal:
1. When
handling the soldering
iron, use a proper force and
keep a careful manner.
2. When
removing the chip, do not use undue force with the
pincette.
3. The
soldering
iron
in use should
operate
on
AC
mains;
it is best if provided with a thermal contro!
(240° or so).
4. The chip once removed must not be used again.
Brajded
Tubular chip
wire
Soldering iron
Copper foil
surface
Solder
is)
~—
P.W.B.
Adhesive
Figure 23—1
Pincette
Tubular chip
Copper foil
Soldering iron
surface
r
P.W.B.
Adhesive
Figure 23-2
Attachment of Tubular-Shaped Chip
1. Temporarily solder one terminal of the chip on the copper
foil surface. See Fig. 23—3.
2. Holding one end of the chip with a pincette, completely
solter both terminals of it one after another. See Fig. 23—4.
Cautions on attachment:
1. When
soldering
the
chip
terminals,
do not touch
them
directly with the soldering
iron. The soldering must be as
quick as possible being careful not to hurt the terminals and
the body itself.
2. When
touching the chip with a pincette, hold its terminal
but never its body. See Fig. 23—4.
3. Keep
the chip's body
in contact
with
the P.W.B.
when
soldering.
4. The
soldering
iron
in use should
operate
on
AC
mains;
it is best if provided with a thermal control (240° or so).
5. The soldering amount
must be enough but not be outside
the specified area.
General Cautions on Handling and Storage
1. Oxidization on the chip's terminals results in poor soldering.
Do not handle them with bare hands.
2. For storage, avoid the following places where oxidization
will
occur
and
their
capacitance
or
resistance
will
be
deteriorated.
1) Sulfur or chlorine gas floating places
2) Directly sunlit places
3) High temperature/high humidity places
Soldering iron
Solder
Copper foil
surface
as
P.W.B.
Figure 23-3
Soldering iron
Pincette
NS
Solder
Copper foil
surface
+
P.W.B.
Tubular chip
Figure 23—4
—23—
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