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LG MG300d Service Manual

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Service Manual
MG300d
Date: January, 2006 / Issue 1.0

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  • Page 1 Service Manual MG300d Date: January, 2006 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION ......5 4.3 Power On Trouble........78 4.4 Charging Trouble ........80 1.1 Purpose........... 5 4.5 Vibrator Trouble ........82 1.2 Regulatory Information......5 4.6 LCD Trouble...........84 1.3 Abbreviations .......... 7 4.7 BT Trouble ..........87 2. PERFORMANCE......9 4.8 Speaker Trouble ........90 2.1 H/W Feature..........
  • Page 3 11. AUTO CALIBRATION....135 11. AUTO CALIBRATION ......135 11.1 Overview ..........135 11.2 Requirements........135 11.3 Menu and Settings ......135 11.4 AGC ...........137 11.5 APC............137 11.6 ADC ...........137 11.7 Setting..........137 11.8 How to do calibration ......137 12. EXPLODED VIEW & REPLACEMENT PART LIST ..140 12.1 EXPLODED VIEW ......

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 5 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 6: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electrostatic Discharge...
  • Page 7 1. INTRODUCTION Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM...

  • Page 8: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Target Specification Form Factor Clam Shell (Dual LCD) Size 89.9 X 46.2 X 23 mm Weight Battery 3.7V, 1000 mAh LI-Ion Talk Time Up to 3h : GSM Tx Level 7 Standby Time Up to 200 hrs : Paging Period 9, RSSI 85dBm Antenna Internal Antenna...
  • Page 9 2. PERFORMANCE Function Target Specification RSSI (5 Level) Battery Charging (5 Level) Display Multi-Language (English, French, German, Spanish, Dutch, etc.) Quick Access Mode(HOT KEY) PLMN/Service Indicator Number of Keys : 24 Key (including Soft key, side key) Soft Function Keys : 2 Keypad International Access (+)(long 0) HotKey : OK,...
  • Page 10 2. PERFORMANCE Read Cell Broadcast Cell Broadcast Cell Broadcast Categories Cell Broadcast Message Language Number Store and Recall Alpha Store and Recall Search the Phone Book in call Scroll by alpha or number Last Number Dialled (20) Last Number Missed (10) Phone Book Last Number Received (20) Copy &...
  • Page 11 2. PERFORMANCE Call Forwarding All Incoming Calls Call Forwarding On Busy Call Forwarding No Reply Call forwarding Not-reachable Call Barring All Outgoing Calls Supplementary Services Call Barring All Outgoing International Calls Call Barring All Outgoing int. Calls except to Home Country Call Barring All incoming Calls Call Barring All incoming Calls when roaming Conference Call (up to 5 calls)
  • Page 12 2. PERFORMANCE Text Input T9 (Predictive word input) Organizer Scheduler & Calendar Setting Local time World Time Number of Selectable Cities: 65 Unit converter Weight/Length/Square/Volume Calculator Addition, Subtraction, Multiplication, Division Edit, save and sending SMS on PC Scheduler Sync PC Sync Phone Book Sync Internet Kit supporting PC OS (98,2000,ME,XP) Contents D/Load (Wallpaper/Ringtone)
  • Page 13 2. PERFORMANCE Read and Save MMS Message Preview MMS Message Send and Receive MMS Message Previous, Next slide Set timer MMS (3GPP R5) Remove media Delete slide (up to 30 pages) Attach MMS media (Text, Audio, Picture) Audio: SP-MIDI, I-Melody (AMR: supported) Picture: GIF87,GIF89a, PNG, JPEG, WBMP version 2.0 @ TELECA JAVA...

  • Page 14: Rf Characteristics

    2. PERFORMANCE 2.2 RF Characteristics 1) Transmitter Item GSM 850 DCS1800 100kHz ~ 1GHz -36dBm -36dBm 1GHz ~ 12.75GHz -30dBm MS allocated 1GHz ~ 1710MHz -30dBm Channel 1710MHz ~ 1785MHz -36dBm 1785MHz ~ 12.75GHz -30dBm 100kHz ~ 880MHz -57dBm -57dBm Conducted 880MHz ~ 915MHz -59dBm...
  • Page 15 2. PERFORMANCE Item GSM850 DCS1800 Frequency Error Under 3dB below reference sensitivity 3dB below reference sensitivity Multipath and Interference RA250: ±300Hz RA130: ±400Hz Condition HT100: ±180Hz HT100: ±350Hz TU50: ±160Hz TU50: ±260Hz TU3: ±230Hz TU1.5: ±320Hz 0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB 200kHz...
  • Page 16 2. PERFORMANCE 2) Receiver Item GSM850 DCS1800 Sensitivity (TCH/FS Class II) -105dBm -105dBm Co-Channel Rejection C/Ic= 7dB C/Ic= 7dB (TCH/FS Class II, RBER, TUhigh/FH) 200kHz C/Ia1= -12dB C/Ia1= -12dB Adjacent Channel Rejection 400kHz C/Ia2= -44dB C/Ia2= -44dB Wanted Signal: -98dBm Wanted Signal: -96dBm Intermodulation Rejection 1’st interferer: -44dBm...

  • Page 17: Technical Specification

    2. PERFORMANCE 2.3 Technical Specification Item Description Specification GSM850 Tx = 824+(N-128)X0.2 MHz Rx = 869+(N-128)X0.2 MHz(N=128~251) Frequency Band TX: 1710 + (n-512) x 0.2 MHz RX: 1805 + (n-512) x 0.2 MHz (n=512~885) TX: 1810 + (n-512) x 0.2 MHz RX: 1905 + (n-512) x 0.2 MHz (n=512~885) RMS <...
  • Page 18 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 600 ~ 1,200 1,200 ~ 1,800 1,800 ~ 3,000 3,000 ~ 6,000 Output RF Spectrum 6,000 (due to modulation) DCS, PCS Offset from Carrier (kHz). Max. dBc +0.5 600 ~ 1,200 1,200 ~ 1,800...
  • Page 19 2. PERFORMANCE Item Description Specification DCS, PCS Offset from Carrier (kHz) Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Spurious Emissions Conduction, Emission Status GSM, EGSM BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS, PCS BER (Class II) <...
  • Page 20 2. PERFORMANCE Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side Tone Distortion Three stage distortion < 10% System frequency 2.5 ppm (13 MHz) tolerance 32.768KHz tolerance 30ppm...
  • Page 21 2. PERFORMANCE Item Description Specification Forced shut down Voltage 3.35 0.03 V 1 Li-ion Battery Standard Voltage = 3.7 V Battery Type Battery full charge voltage = 4.2 V Capacity: 800mAh Switching-mode charger Travel Charger Input: 100 ~ 240 V, 50/60Hz Out put: 5.2V, 800mA - 22 -...

  • Page 22: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Power Transceiver (SKY74400, U500) The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VCTCXO part. The SKY74400 power transceiver is a highly integrated device for quad-band Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), and Enhanced Data for GSM Evolution (EDGE) handsets.
  • Page 23 3. TECHNICAL BRIEF Figure. 3-1 SKY74400 FUNCTIONAL BLOCK DIAGRAM - 24 -...
  • Page 24 3. TECHNICAL BRIEF (1) Receiver Part A. LNA and Quadrature Demodulator Four separate LNAs are integrated in the SKY74400 to address different bands of operation. These LNAs have separate singleended 50Ω inputs. The LNA gain is switchable between high and low settings using the three-wire bus.
  • Page 25 3. TECHNICAL BRIEF (2) Synthesizer Section The SKY74400 includes a fully integrated UHF VCO and 3rd order loop filter. A single sigma-delta fractional-N synthesizer phaselocks the Local Oscillator (LO) used in both transmit and receive paths to a precision frequency reference input. Fractional-N operation offers low phase noise and fast settling times, allowing for multiple slot applications such as GPRS.
  • Page 26 3. TECHNICAL BRIEF This speeds up frequency settling and ensures that the PLL control voltage never operates close to the rails. DFC is the result of an adaptive circuit that corrects for any VCO center frequency errors caused by variations of the integrated VCO circuit such as temperature, supply voltage, or aging. The VCO can be centered at any frequency in the range from 990 MHz to 1550 MHz.
  • Page 27 3. TECHNICAL BRIEF Figure. 3-2 Crystal Oscillator BLOCK DIAGRAM (3) Transmitter Part To minimize the post-PA filtering requirements and any additional post-power amp losses, the transmit path consists of a vector modulator and a frequency translation loop. The translation loop consists of the following: •...
  • Page 28 3. TECHNICAL BRIEF C. Power Amplifier (PA) The PA functionality of the SKY74400 consists of separate GSM850/EGSM900 and DCS1800/PCS1900 blocks, impedancematching circuitry for 50Ω output impedances, and a PAC block with an internal currentsense resistor. The custom BiCMOS integrated circuit provides the internal PAC function and interface circuitry.

  • Page 29: 13 Mhz Clock

    3. TECHNICAL BRIEF 3.2 13 MHz Clock (VCTCXO, X500) The 13 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the SKY74400, analog base band chipset (U101, AD6535), digital base band chipset (U102, AD6527B). 2V75_VVCXO 13MHz R505...
  • Page 30 3. TECHNICAL BRIEF TP500 TP501 C531 C500 R500 1.8p L500 8.2nH SW500 KMS-506 ANT_SW3 ANT_SW2 ANT_SW1 C502 1000p FL500 LMSP54LA-445TEMP GSM1900_RX GSM1800_RX GSM900_RX GND7 GND6 GND5 GND4 GSM18001900_TX GND3 GSM900_TX GND2 GND1 Figure 3-4 FEM CIRCUIT DIAGRAM - 31 -...

  • Page 31: Digital Main Processor

    3. TECHNICAL BRIEF 3.4 Digital Main Processor (AD6527B, U102) AD6527/AD6527B GSM-PROCESSOR JTAGEN KEYPADCOL[7:0] Keypad KEYPADROW[7:0] TCK,TMS JTAG Matrix TDI,TDO BACKLIGHT[3.0] Backlight/ JTAG,HSL,GPIO Service Light Universal Servicelight USCTX/RX/CLK System Enhanced Generic Serial Port A Connector Generic Serial Port B Generic Serial Port D (USC) Flash ROMCS[1:0]...
  • Page 32 3. TECHNICAL BRIEF • AD6527 is an ADI designed processor. • AD6527 consists of 1. Control Processor Subsystem • 32-bit ARM7TDMI Control Processor • 58.5 MHz operation at 1.7V • On-board 16KB instruction/Data Cache • 1 Mbits of on-chip System SRAM 2.
  • Page 33 3. TECHNICAL BRIEF 3.4.1 Interconnection with external devices A. RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz B. LCD module interface The LCD module is controlled by AD6527B(U102),DBB. In operating mode, the AD6527B(U102) controls the LCD module through _LCD_CS, LCD_DIM_CTRL, LCD_RESET, _WR, 2V8_VMEM, LCD_ID, LCD_BL_EN.
  • Page 34 3. TECHNICAL BRIEF The backlight of LCD module is controlled by DBB via AAT2806IXN-4.5-T1 , U402. The control signals related to Backlight LED are given bellow. Signals Description LCD_DIM_CTL Control LCD backlight level in 16 steps (GPO 5) LCD_LED_CTL Control LCD LED LCD_DIM_CTRL Control LCD BACK LIGHT _SUB_CS...
  • Page 35 3. TECHNICAL BRIEF D. SIM interface The AD6527B provides SIM Interface Module. The AD6527 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST(GPIO_23) are required.
  • Page 36 3. TECHNICAL BRIEF 3.4.2 AD6527 Architecture AD6527/AD6527B AD6527/AD6527B AD6535 SErial Link SErial Link Audio Baseband Audio Baseband Subststem Subststem and Power and Power Management Management DSP BUS DSP BUS EBUS EBUS PBUS PBUS DMA and BUS DMA and BUS RBUS 1M ARBITRATION ARBITRATION SBUS...

  • Page 37: Analog Main & Power Management Processor

    3. TECHNICAL BRIEF 3.5 Analog Main & Power Management Processor (AD6535, U101) Figure 3-8. AD6535 FUNCTIONAL BLOCK DIAGRAM - 38 -...
  • Page 38 3. TECHNICAL BRIEF • AD6535 is an ADI designed Analog Baseband processor. AD6535 covers the processing GMSK modulation interface, Aux ADC, Voice signal processing and Power Management. • AD6535 consists of 1. BB Transmit section • GMSK Modulation • I-channel & Q-channel Transmit DACs and Filters •...
  • Page 39 3. TECHNICAL BRIEF 3.5.1 Baseband Transmit Section 1. The AD6535 Baseband Transmit Section is designed to support GMSK for both single-slot and multi-slot application. 2. The AD6535 includes a digital GMSK modulator which is used for GSM application. The GMSK modulator uses a ROM lookup table to modulate the serial data stream ffrom the BSPORT.
  • Page 40 3. TECHNICAL BRIEF 3.5.3 Auxiliary Section 1. This section includes an Automatic Frequency Control(AFC) DAC, voltage reference buffers, an Auxiliary ADC, and light controllers. • AFC DAC: 13 bits 2. This section also contains AUX ADC and Voltage Reference • IDAC: 10 bits •...
  • Page 41 3. TECHNICAL BRIEF 3.5.4 Audio Section 1. The AD6535 Audio section supports communications and personal audio applications. 2. The Audio Section provides an audio codec with two digital-to-analog converter, a ring tone volume controller, a microphone interface, and analog input and output channels. Figure 3-12.

  • Page 42: Power Management

    3. TECHNICAL BRIEF 3.5.5 Power Management Figure 3-13. AD6535 POWER MANAGEMENT SECTION 1. Power up sequence logic 1. The AD6535 controls power on sequence 2. Power on sequence - If a battery is inserted, the battery powers the 8 LDOs. - Then if PWRONKEY is detected, the LDOs output turn on.
  • Page 43 3. TECHNICAL BRIEF Figure 3-14. AD6535 POWER MODE LOGIC 2. LDO Block 1. There are 8 LDOs in the AD6535. - VCORE : supplies Digital baseband Processor core and AD6535 digital core - VMEM : supplies external memory and the interface to the external memory on the digital baseband processor (1,8V or 2.8V, 150mA) - VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA)
  • Page 44 3. TECHNICAL BRIEF 3. Battery Charging Block 1. It can be used to charge Lithium Ion batteries. Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware. 2. Charging Process - Check charger is inserted or not - If AD6535 detects that Charger is inserted, the CC-CV charging starts. - Exception : When battery voltage is lower than 3.2V, the precharge(low current charge mode) starts firstly.

  • Page 45: Chargind Ic

    3. TECHNICAL BRIEF 3.6 Chargind IC (ISL6299, U704) VUSBIN VCHARGE Charging IC VBAT 2V8_VEXT D700 CUS02 U704 ISL6299 CUR_MON CRDL R722 (ABB AUX2) C731 R723 R724 100K IMIN _PPR _CHG CHG_STAT ICDL (GPIO1) USBON CHG_EN PGND (GPIO0) R728 R731 C738 C739 R729 C740...
  • Page 46 3. TECHNICAL BRIEF 3.6 Chargind IC (ISL6299, U704) Figure 3-15. BLOCKDIAGRAM Cradle Charge Current The cradle charge current is enabled by the EN pin only, the USBON pin has no control on the cradle charge current. The cradle charge current is programmed with the external resistor connected between the ICDL pin and the GND pin.
  • Page 47 3. TECHNICAL BRIEF 3.6 Chargind IC (ISL6299, U704) Trickle Charge Current When the battery voltage is below the minimum battery voltage VMIN given in the electrical specification, the charger operates in a trickle/preconditioning mode, where the charge current is typically 14% of the programmed charge current for the cradle input. If power comes from the USB input, the trickle mode current is approximately 53mA.

  • Page 48: Camera Ic

    3. TECHNICAL BRIEF 3.7 CAMERA IC(AIT813,U504) Figure 3-15. AIT813 APPLICATION BLOCKDIAGRAM - 49 -...
  • Page 49 3. TECHNICAL BRIEF 2V8_AMV 2V8_MV 1V8_MV C400 C403 C404 3V3_MULTI_USB MULTI_USB- PUSBDN C408 MULTI_USB+ PUSBDP PGPIO25 N_IO(2) VDD_IO3 PGPIO24 N_IO(1) GND_IO3 PGPIO23 N_IO(0) _PHCS PGPIO22 _N_WP C409 _PHRD PGPIO21 _N_WE _LCD_CS N_ALE _PHWE PGPIO20 _MULTI_RST N_CLE _PRST PGPIO19 2V8_MV 2V6_CAM _NAND_CS PGPIO18 DATA00...

  • Page 50: Midi Ic

    3. TECHNICAL BRIEF 3.8 MIDI IC(YMU787, U703) Figure 3-24. YMU787 BLOCKDIAGRAM - 51 -...
  • Page 51 3. TECHNICAL BRIEF SPKPM C708 1000p R706 TP700 3.3K _MIDI_RST _RST 13MHz CLKI SPOUT2L I2S_SCK BLCK SPOUT1L R710 I2S_WS LRCK SPOUT2R SPK_N C716 I2S_SDO SPOUT1R C717 C718 U703 R715 GPIO0 YMU787 TXOUT R716 GPIO1 EXTOUT SPK_P GPIO2 GPIO3 LED2_GPIO5 HPOUTL LDE1_GPIO4 Close to SPEAKER R717...
  • Page 52 3. TECHNICAL BRIEF CONTROL REGISTER;ROM/SRAM The Control register and ROM/SRAM are accessed from”Instantaneous write register”, “Delayed write register”, and “Instantaneous read register”in the intermediate register. In the control register, there is a register to control the following synthesizer mainly. The voice parameter for FM(GM 128 voices+DRUM 40 voices)and wave data for WT are stored in ROM.
  • Page 53 3. TECHNICAL BRIEF LED,VIBRATOR CONTROL It is possible to synchronize an LED and vibrator with a play, and to control. Asynchronous control With a play is also supported. It supports 3 color LED control and it is possible to display 7 colors In maximum.

  • Page 54: Keypad Switches And Scanning

    3. TECHNICAL BRIEF 3.9 Keypad Switches and Scanning VOL_DOWN VOL_UP VBAT CAMERA R313 SW300 POWERKEY R314 R317 R318 R319 R320 R321 SW301 SW302 KEY_ROW0 SW303 SW304 SW305 SW306 SW307 LEFT MENU KEY_ROW1 SW308 SW309 SW310 SW311 SW312 KEY_ROW2 SW313 SW314 SW315 SW316 SW317...

  • Page 55: Microphone

    3. TECHNICAL BRIEF 3.10 Microphone The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to AIN1P and AININ pins of AD6535. The voltage supply VMIC is output from AD6535, and is a biased voltage for the AIN2P.

  • Page 56: Headset Interface

    3. TECHNICAL BRIEF 3.12 Headset Interface 2V8_VEXT 2V5_JACK 2V5_JACK U200 HEADSET JACK R200 VOUT C202 R201 R202 R203 NCP563Q25T1 0.1u C200 C201 1.5K 0.1u 0.1u AUXIN HOOK_DETECT C204 C203 C205 R204 0.1u 2V8_VEXT 2V8_VEXT R205 J200 C207 C206 R206 EAR_SPK_L R207 R208 AUXIP...

  • Page 57: Memory

    3. TECHNICAL BRIEF 3.13 MEMORY(INTEL,U204) MEMORY (256MbitFLASH+64Mbit PSRAM) 2V8_VMEM C220 ADD01 DATA00 ADD02 DATA01 0.1u ADD03 DATA02 ADD04 DATA03 TC7SH08FS ADD05 DATA04 U203 _ROM_CS2 ADD06 DATA05 _ROMCS1 ADD07 DATA06 _ROM_CS1 ADD08 DATA07 ADD09 DATA08 ADD10 DATA09 ADD11 DATA10 ADD12 DATA11 ADD13 DATA12 ADD14...

  • Page 58: Bluetooth

    3. TECHNICAL BRIEF 3.13 BLUETOOTH(LBMA-2C67B2,M700) BLUETOOTH VBAT 2V8_VBT (Change to Patrol) U700 AMAN542015LG02 BT_ANT VOUT BGND FEED GND2 R700 BT_EN STBY GND1 BH28FB1WHFV L700 C702 C703 C704 C705 C706 C707 2.2u 0.1u 2.2u 2V8_VBT 2V8_VBT M700 LBMA-2C67B C710 R705 0.1u _BT_RST RESETB VDD_1_8V...

  • Page 59: Camera Connector, Camera Ldo

    3. TECHNICAL BRIEF 3.13 CAMERA CONNECTOR, CAMERA LDO(U404) 2V6_CAM 1V8_CAM CN102 CAMERA CONN C_DATA07 C_SCK C_DATA06 C_SDA C_DATA05 C_DATA04 C_VS C_DATA03 C_HS C_DATA02 C_MCLK C_DATA01 C_DATA00 C_PCLK C_RST Figure 3-30. CAMERA CONNECTOR VBAT 1V8_CAM 2V6_CAM U404 MIC2211-GKBML VOUT1 CAM_PWR_EN VOUT2 BGND C425 C426...

  • Page 60: Flash Led Chargepump

    3. TECHNICAL BRIEF 3.13 FLASH LED CHARGE PUMP (AAT2807AIXN-4.5 U401) FLASH LED CHARGEPUMP VBAT FB400 R406 VOUT_FL FLASH_LED C413 FB401 VOUT_BL MLED U401 AAT2807AIXN-4.5 PGND (GPIO_24) R410 1.5K C_FLASH EN_FLSH ISINK1 MLED1 ISINK2 MLED2 LCD_DIM_CTRL EN_SET ISINK3 MLED3 Figure 3-30. CHAGE PUMP - 61 -...

  • Page 61: Nand Memory

    3. TECHNICAL BRIEF 3.13 NAND MEMORY(K9F1208X0B-JIB0, U705) 512M NAND 2V8_MV 2V8_MV R720 R721 100K 100K K9F1208X0B-JIB0 U705 N_IO(7) _NAND_CS N_IO(6) _N_WP N_IO(5) _N_WE N_IO(4) _N_RE N_IO(3) N_ALE N_IO(2) N_IO(1) N_CLE N_IO(0) NC25 NC26 NC27 NC28 NC29 NC30 NC31 NC32 NC33 NC34 NC35 NC36...

  • Page 62: Flip Switch

    3. TECHNICAL BRIEF 3.13 FLIP SWITCH (U400) FLIP SWITCH R400 FLIP A3212EEH-T U400 OUTPUT GND2 C401 C402 PGND GND1 0.01u Figure 3-30. FLIP SWITCH - 63 -...

  • Page 63: Vibrator

    3. TECHNICAL BRIEF 3.14 VIBRATOR The vibrator is placed in the folder cover and contacted to LCD MODULE. The vibrator is driven from VIBRATOR from AD6527B. VBAT VIBRATOR R364 VBAT R365 Q301 R366 R367 VIBRATOR 1.5K R368 MOTOR 7.5K D300 EMZ2 C330 1SS352-TPH3_F...

  • Page 64: Troubleshooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RX Trouble Test Points SKY74400 13Mhz OSCILLATOR Figure 4-1(a) - 65 -...
  • Page 65 4. TROUBLE SHOOTING Checking Flow START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting Check VCTCXO Check FEM & Mobile SW Check RX IQ Redownload SW or Do calibration again - 66 -...
  • Page 66 4. TROUBLE SHOOTING (1) Checking VCTCXO Circuit Test Points Checking Flow VCTCXO Circuit is OK VCTCXO Circuit is OK 13 MHzO.K? See next Page to check See next Page to check Check Pin 3. ANT SW & Mobile SW ANT SW & Mobile SW Refer to Graph 4 -1(b) Changing X500 2.75V OK?
  • Page 67 4. TROUBLE SHOOTING (2) Checking FEM & Mobile SW Test Points Figure 4-5 Circuit Diagram Waveform C500 R500 1.8p L500 8.2nH SW500 KMS-506 ANT_SW3 ANT_SW2 ANT_SW1 C502 FEM Control GSM& DCS 1000p Graph 4-3(a) FL500 LMSP54LA-445TEMP GSM1900_RX GSM1800_RX GSM900_RX GND7 GND6 GND5 GND4...
  • Page 68 4. TROUBLE SHOOTING Checking Flow For these 2 test case, No Call connection is needed Check SW500 Pin ANT,RF Changing SW500 Open with RF Cable connected. Check SW500 Pin ANT,RF Changing SW500 Short with No RF Cable Connected Check C503,C504,C505 VC1 :Low or HIGH Changing the Board.
  • Page 69 4. TROUBLE SHOOTING (3) Checking RX IQ Test Points Circuit Diagram C507 C508 C509 0.1u VCC3 C510 I+_TX_I+ I-_TX_I- Q-_TX_Q- Q+_TX_Q+ VBAT VCC1 C511 PED_SELECT C512 0.1u C513 ENABLE VAPC Waveform Graph 4-4 Checking Flow Check C510,C511. Check if there is any Replace U500 Similar? Major difference...

  • Page 70: Tx Trouble

    4. TROUBLE SHOOTING 4.2 TX Trouble Test Points SKY74400 13Mhz OSCILLATOR - 71 -...
  • Page 71 4. TROUBLE SHOOTING Checking Flow START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting Check VCTCXO Check FEM & Mobile SW Check SIGNAL Check TX IQ Redownload SW or Do calibration again - 72 -...
  • Page 72 4. TROUBLE SHOOTING (1) Checking VCTCXO Circuit Test Points Checking Flow VCTCXO Circuit is OK VCTCXO Circuit is OK 13 MHzO.K? Check Pin 3. See next Page to check See next Page to check ANT SW & Mobile SW ANT SW & Mobile SW Refer to Graph 4-1(b) 2.75V OK? Changing X500...
  • Page 73 4. TROUBLE SHOOTING (2) Checking Ant SW & Mobile SW Test Points Figure 4-5 Waveform Circuit Diagram VC1 LOW SW500 KMS-506 VC2 LOW ANT_SW3 ANT_SW2 ANT_SW1 VC3 HIGH C502 1000p Graph 4-6(a) FEM Control EGSM GSM1900_RX GSM1800_RX GSM900_RX GND5 GND4 GND3 VC1 LOW GND2...
  • Page 74 4. TROUBLE SHOOTING Checking Flow For the test, TX Stand alone Mode is needed. (PL=7 for GSM, PL=2 for DCS) Check C503,C504,C505 Check whether FEM Check VC1, VC2, VC3 Changing board Set as TX mode Rrefer to Graph4-6(a), 4-6(b) Rrefer to Table 4-3 Check RF Level of Pin10 : ~29.5dBm Go to 4.3.5 Checking PAM...
  • Page 75 4. TROUBLE SHOOTING (3) Checking PAM Control Signal Test Points Circuit Diagram VBAT PED_SELECT C512 0.1u C513 ENABLE VAPC BAND_SELECT VCC_1A VCC_1B VBAT PA_EN TX_RAMP R501 GND1 PA_BAND GND2 GND3 GND4 C517 GND5 GND6 C518 GND7 C521 0.01u GND8 4.7u GND9 Waveform Graph 4-6...
  • Page 76 4. TROUBLE SHOOTING (4) Checking TX IQ Test Points Waveform Graph 4-8 Circuit Diagram C507 C508 C509 0.1u VCC3 C510 I+_TX_I+ I-_TX_I- Q-_TX_Q- Q+_TX_Q+ VBAT VCC1 C511 PED_SELECT C512 0.1u C513 ENABLE VAPC Checking Flow Check if there is Any Major Difference Replace U500 Similar? Refer to Graph 4 -8...

  • Page 77: Power On Trouble

    4. TROUBLE SHOOTING 4.3 Power On Trouble Test Points VABB VVCXO VRTC VEXT VSIM VMEM VCORE Circuit Diagram R100 BACK_BATT C114 VCORE1 VCORE2 C115 VMEM1 VMEM2 C116 0.1u VRTC C117 VSIM (1608) C118 2.2u VABB C119 VMIC C120 VVCXO C123 VUSB C124 VEXT1...
  • Page 78 4. TROUBLE SHOOTING Checking Flow START Check Battery Voltage Charge or Change Battery > 3.35V ? Push power-on key Check the contact of power key And check the level change Or dome-switch of PWRKEY Check the voltage of Replace U101 The LDO outputs at U101 VCORE=1.8V VVCXO=2.75V...

  • Page 79: Charging Trouble

    4. TROUBLE SHOOTING 4.4 Charging Trouble Test Points R728 U704 D700 Circuit Diagram VUSBIN VCHARGE Charging IC VBAT 2V8_VEXT D700 CUS02 U704 ISL6299 CUR_MON CRDL R722 (ABB AUX2) C731 R723 R724 100K IMIN _PPR _CHG CHG_STAT ICDL (GPIO1) USBON CHG_EN PGND (GPIO0) R728...
  • Page 80 4. TROUBLE SHOOTING Checking Flow START I/O Connector(CN600) Resolder the CN600 Is well-soldered ? The TA is out of order Voltage at anode of Change the TA D700 = 5.2V ? Resolder the D700, U704 are D700,U704 well-soldered? Replace the Voltage across R728 is D700,U704 about 1.2V?

  • Page 81: Vibrator Trouble

    4. TROUBLE SHOOTING 4.5 Vibrator Trouble Test Points R367 Q301 C330 Circuit Diagram VBAT VIBRATOR R364 VBAT R365 Q301 R366 R367 VIBRATOR 1.5K R368 MOTOR 7.5K D300 EMZ2 C330 1SS352-TPH3_F 4.7u - 82 -...
  • Page 82 4. TROUBLE SHOOTING Checking Flow SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu START Is the voltage at pin 6 Check the soldering Resolder R367. of Q301 near 0V? of R367. Replace Q301 Check the contact state Re-contact CN600 of CN600...

  • Page 83: Lcd Trouble

    4. TROUBLE SHOOTING 4.6 LCD Trouble Test Points EMI FILTER CN600 - 84 -...
  • Page 84 4. TROUBLE SHOOTING Circuit Diagram - Main PCB 1.3M Pixel CAMERA 128x160 MAIN OLED-LCD 96x64 SUB OLED LCD FL600 L_DATA00 INOUT_B4 INOUT_A4 L_DATA01 INOUT_B3 INOUT_A3 L_DATA02 INOUT_B2 INOUT_A2 L_DATA03 INOUT_B1 INOUT_A1 ICVE21054E250R401FR FL601 FL602 2V6_CAM L_DATA04 INOUT_A1 INOUT_B1 2V8_MV 2V6_CAM VBAT 1V8_CAM L_DATA05...
  • Page 85 4. TROUBLE SHOOTING Checking Flow START Refer to Power is supplied to Power On Trouble the board? Connection between Reconnect FPCB and boards is OK? FPCB CN600 is soldered well? Re-solder the CN600 Paths of LCD control Re-solder signals are OK? the EMI filter FPCB is OK? Replace the FPCB...

  • Page 86: Bt Trouble

    4. TROUBLE SHOOTING 4.7 BT Trouble Test Points BT_EN _BT_RST 2V8_VBT DUBUG_TX DUBUG_RX Circuit Diagram BLUETOOTH VBAT 2V8_VBT (Change to Patrol) U700 AMAN542015LG02 BT_ANT VOUT BGND FEED GND2 R700 BT_EN STBY GND1 BH28FB1WHFV L700 C702 C703 C704 C705 C706 C707 2.2u 0.1u 2.2u...
  • Page 87 4. TROUBLE SHOOTING Checking Flow Is BT_RST signal shape similar Replace U102 to Fig.1 during Powering on Bluetooth 2V8_VBT at C706=2.8V Replace U102 BT_EN at R700=2.8V Bluetooth Power off Replace U700 Is DEBUG_TX signal similar to Replace U102 Fig.2 during Powering on Bluetooth? Is DEBUG_RX signal similar to Replace M700 Fig.2 during Powering on Bluetooth?
  • Page 88 4. TROUBLE SHOOTING Figure 1_Blue_RST Figure 2_DEBUG_Tx, Rx Figure 3_PCM_SYNCS, Tx, Rx, USCO - 89 -...

  • Page 89: Speaker Trouble

    4. TROUBLE SHOOTING 4.8 Speaker Trouble Test Points Circuit Diagram SPOUT2L SPOUT1L R710 SPOUT2R SPK_N C716 SPOUT1R C717 C718 R715 TXOUT R716 EXTOUT SPK_P - 90 -...
  • Page 90 4. TROUBLE SHOOTING Checking Flow START Check the state of Reassemble speaker contact of dual speaker Re-solder C717,C718 C717,C718Well-soldered? Check Re-solder U703 U703 works properly Speaker Change main board Works properly? Speaker working! - 91 -...

  • Page 91: Sim Card Interface Trouble

    4. TROUBLE SHOOTING 4.9 SIM Card Interface Trouble Test Points J300 Circuit Diagram 2V85_VSIM 2V85_VSIM SIM CONNECTOR R354 SIM_RST R355 R356 SIM_DATA SIM_CLK J300 - 92 -...
  • Page 92 4. TROUBLE SHOOTING Checking Flow START Change the SIM Card. Our phone Does the SIM cards supports only 3V SIM card. supports 3V ? Voltage Replace J300 or Voltage at pin1 of at VSIM of U101 check soldering of components J300 is 3V? Is 3V? Change the SIM Card...

  • Page 93: Earphone Trouble

    4. TROUBLE SHOOTING 4.10 Earphone Trouble Test Points C208 C206 Circuit Diagram 2V8_VEXT 2V5_JACK 2V5_JACK U200 HEADSET JACK R200 VOUT C202 R201 R202 R203 NCP563Q25T1 0.1u C200 C201 1.5K 0.1u 0.1u AUXIN HOOK_DETECT C204 C203 C205 R204 0.1u 2V8_VEXT 2V8_VEXT R205 J200 C207...
  • Page 94 4. TROUBLE SHOOTING Checking Flow START Does the audio Level at profile of the phone Replace J200 JACK_DETECT signal change to the is low earphone mode? Set the audio part of the test equipment to Set the audio part of the test Change the earphone PRBS or continuous Equipment to echo mode...

  • Page 95: Receiver Trouble

    4. TROUBLE SHOOTING 4.11 Receiver Trouble Test Points Circuit Diagram R113 AOUT1P RCV_P C143 AOUT1N AOUT2P1 SPKPM R115 AOUT2P2 RCV_N AOUT2N1 AOUT2N2 AOUT3L AUX_OUT_L AOUT3R AUX_OUT_R C144 C145 C146 C147 C148 C149 SPK_RCV_P SPK_RCV_N R604 OLED_ON R605 FL607 LCD_RD INOUT_A1 INOUT_B1 C_SDA INOUT_A2...
  • Page 96 4. TROUBLE SHOOTING Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max. START Check the state of Resolder receiver soldering of receiver R113,R115 Resolder R113,R115...

  • Page 97: Microphone Trouble

    4. TROUBLE SHOOTING 4.12 Microphone Trouble Test Points Circuit Diagram AIN3L AIN3R AIN2P AUXIP AIN2N AUXIN AIN1P VINNORP AIN1N VINNORN NC_R12 C138 C139 C140 C141 CLOSE TO AD6537B J200 2V5_VMIC CLOSE TO MIC R212 R213 C214 C213 SOB-413S44-RC3310 2.2K R214 R215 MIC200 C215...
  • Page 98 4. TROUBLE SHOOTING Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS mode START Voltage across C213 Voltage VMIC of U101 Replace U101 = DC 2.5V ? = DC 2.5V? Check the signal Level at each side Replace microphone of MIC.

  • Page 99: Rtc Trouble

    4. TROUBLE SHOOTING 4.13 RTC Trouble Test Points Circuit Diagram _MIDI_CS NAUXCS1 _LCD_CS GPIO_42_NMAIN_LCD_CS _SUB_CS GPIO_43_NSUB_LCD_CS X100 C134 1000p CLKIN C129 CLKON CLKON OSCOUT R110 OSCIN PWRON PWRON _RESET NRESET MC-146_7pF C135 32.768KHz CHG_EN GPIO_0_IRDA_TX CHG_STAT GPIO_1_IRDA_RX VUSB BT_EN GPIO_2_NIRDA_EN VIBRATOR GPIO_3 R111...
  • Page 100 4. TROUBLE SHOOTING Checking Flow START Is the voltage level of BAT101 Charge or change BAT01. > 1.2V ? Check the voltage at Resolder R110 or 1,4 of X101 Replace X101 Change main board - 101 -...

  • Page 101: Download And Calibration

    5. DOWNLOAD AND CALIBRATION 5. DOWNLOAD AND CALIBRATION 5.1 Download A. Download Setup Figure 5-1 describes Download setup UART (If you have battery, no TA is needed) Figure 5-1. Download Setup - 102 -...
  • Page 102 5. DOWNLOAD AND CALIBRATION B. Download Procedure 1. Create a new folder on C: Drive as below after downloading GSMULTI program on GCSC. 2. Execute by double- click 1. Execute by double- click 2. Execution and Configuration Setting 2. Select *.dll file equivalent to the 1.
  • Page 103 5. DOWNLOAD AND CALIBRATION 3. Click ‘Start’ button and then connect the phone and the cable. " START " BTN Click - 104 -...
  • Page 104 5. DOWNLOAD AND CALIBRATION C. Configuration Setting Information Model DLL File select (C:\GSMULTI\Model) Phone Software select (mot,m0 file) TI RAM Loader ( Only TI Model ADI Model : Donít care) Download speed (bps ) Start Com port End Com port Frame count select ìHermesîselect in case TMO DG200...

  • Page 105: Calibration

    5. DOWNLOAD AND CALIBRATION 5.2 Calibration A. Equipment List Equipment for Calibration Type / Model Brand Wireless Communication Test Set HP-8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply HP-66311B Agilent GPIO interface card HP-GPIB Agilent Calibration & Final test software Test SIM Card PC (for Software Installation) Pentium II class above 300MHz...
  • Page 106 5. DOWNLOAD AND CALIBRATION JTAG2 JTAG1 Status ADI-REMOTE TI-REMOTE POWER VBAT UART Status POWER Figure 5-3 The top view of Test JIG C. Test Jig Operation Table 5-2 Jig Power Power Source Description Power Supply usually 4.0V Travel Adaptor Use TA, name is TA-20G(24pin) Table 5-3 Jig DIP Switch Switch Number Name...
  • Page 107 5. DOWNLOAD AND CALIBRATION Table 5-4 LED Description LED Number Name Description LED 1 Power Power is provided for Test Jig LED 2 Indicate charging state of the phone battery LED 3 UART Indicate data transfer state through the UART port LED 4 Indicate data transfer state through the MON port 1.
  • Page 108 5. DOWNLOAD AND CALIBRATION E. Download Procedure 1. Create a new folder as below after downloading ‘Hotkimchi’ program on GCSC. 2. Set up the “C:/CAL/Hot_Kimchi” 3. ‘Info_DB’ file and Configuration setting Ex) Model : C1100 - 109 -...
  • Page 109 5. DOWNLOAD AND CALIBRATION -. To set up Data route, info_Db.TXT should be edited. -. The names in the cycle should be same. 4. Run file name is “Hot_kinchiD.exe” 5. Choose the Model name of mobile phone. 6. Push the “APPLY” button. and push the “CALIBRATION START” button. 7.
  • Page 110 5. DOWNLOAD AND CALIBRATION 8. Push the “START” button. - 111 -...
  • Page 111 5. DOWNLOAD AND CALIBRATION 9. Phone test Finish is shown in below screen. - 112 -...

  • Page 112: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM - 113 -...
  • Page 113 - 114 -...

  • Page 114: Circuit Diagram

    USB BOOT INT CLOCK KEY_COL1 KEYPADCOL1 USC3 USC3 NAME USB BOOT EXT CLOCK KEY_COL2 KEYPADCOL2 USC4 USC4 Approved KEY_COL3 KEYPADCOL3 USC5 USC5 KEYPADCOL4 USC6 KEY_COL4 USC6 DRAWING VER_1.0 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 115 -...
  • Page 115 2 / 7 2005 VSS5 _OE2 VSS6 _RST _RESET VSS7 WAIT _WAIT Checked VSS8 BURSTCLK DRAWING AUDIO/SOUND/MEMORY NAME C228 Approved 220p DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 116 -...
  • Page 116 3 / 7 2005 R367 VIBRATOR 1.5K DRAWING KEY, IO, SIM, VIBRATOR R368 NAME MOTOR 7.5K D300 EMZ2 C330 1SS352-TPH3_F 4.7u DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 117 -...
  • Page 117 Date Sign & Name Sheet/Sheets MG300d MODEL 08/10 Designer HA SUNG WOO 4 / 7 2005 Checked DRAWING CAMERA / Chargepump NAME Approved DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 118 -...
  • Page 118 Sign & Name X500 Sheet/Sheets MG300d(S5100) C529 MODEL 12/08 (1005) Designer C530 5 / 7 lee ki sung 2005 1000p Checked DRAWING RF(SKY) NAME Approved DRAWING Iss. Notice No. Date Name Rev.B LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 119 -...
  • Page 119 Sign & Name Sheet/Sheets MG300d MODEL 08/10 Designer ha sung woo 6 / 7 2005 Checked DRAWING CAMERA / LCD CONNECTOR NAME Approved DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 120 -...
  • Page 120 MODEL MG300d 08/10 Designer HA SUNG WOO URXD 7 / 7 2005 UTXD USC0 USC5 Checked USC4 DRAWING CHARGING / BLUETOOTH NAME Approved DRAWING Iss. Notice No. Date Name VER_1.0 LG Electronics Inc. LG Electronics Inc. LGIC(42)-A-5505-10:01 - 121 -...
  • Page 121 Date Sign & Name Sheet / Sheets MG300d MODEL 04/20 Designer Y.S JEONG 2005 12/31 Y.S.HYUN Checked 2004 DRAWING NAME 12/31 Approved N.S.KIM 2004 DRAWING Ver.B Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. - 122 -...
  • Page 122 Sign & Name Sheet/ Sheets MODEL MG300d 12/31 Designer Y.S.JEONG 2004 12/31 Checked Y.S.HYUN 2004 DRAWING VOLUME_SIDEKEY_FPCB 12/31 NAME Approved N.S.KIM 2004 DRAWING Iss. Notice No. Date Name LG Electronics Inc. Ver A LGIC(42)-A-5505-10:01 LG Electronics Inc. - 123 -...
  • Page 123 Sign & Name Sheet/ Sheets MODEL MG300d 12/31 Designer Y.S JEONG 2004 12/31 Checked Y.S.HYUN 2004 DRAWING CAMERA_SIDEKEY_FPCB 12/31 NAME Approved N.S.KIM 2004 DRAWING Iss. Notice No. Date Name LG Electronics Inc. Ver A LGIC(42)-A-5505-10:01 LG Electronics Inc. - 124 -...

  • Page 124: Pcb Layout

    8. PCB LAYOUT - 125 -...
  • Page 125 8. PCB LAYOUT - 126 -...

  • Page 126: Engineering Mode

    9. ENGINEERING MODE 9. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.

  • Page 127: Bb Test [Menu 1]

    9. ENGINEERING MODE 9.1 BB Test [MENU 1] 9.1.1 LCD 1) COLOUR : WHITE, RED, GREEN, BLUE, BLACK 9.1.2 CAMERA This menu is to test the Camera. 1) Main LCD preview : It shows the picture on Main LCD. 2) Sub LCD preview : It shows the picture on Sub LCD. 3) Flash on : It turns on the Flash LED.
  • Page 128 9. ENGINEERING MODE 9.1.7 ADC (Analog to Digital Converter) This displays the value of each ADC. 1) MVBAT ADC : Main Voltage Battery ADC 2) AUX ADC : Auxiliary ADC 3) TEMPER ADC : Temperature ADC 9.1.8 BATTERY 1) Bat Cal : This displays the value of Battery Calibration. The following menus are displayed in order : BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT, SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT...

  • Page 129: Rf Test [Menu 2]

    9. ENGINEERING MODE 9.2 RF Test [MENU 2] 9.2.1 SAR test This menu is to test the Specific Absorption Rate. 1) SAR test on : Phone continuously process TX only. Call-setup equipment is not required. 2) SAR test off : TX process off 9.3 MF mode [MENU 3] This manufacturing mode is designed to do the baseband test automatically.

  • Page 130: Trace Option [Menu 4]

    9. ENGINEERING MODE 9.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 9.5 Call timer [MENU 5] This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing. 1) All calls : This displays total conversation time.

  • Page 131: Stand Alone Test

    10. STAND ALONE TEST 10. STAND ALONE TEST 10.1 Introduction This manual explains how to examine the status of RX and TX of the model. A. Tx Test TX test - this is to see if the transmitter of the phones is activating normally. B.

  • Page 132: Means Of Test

    10. STAND ALONE TEST 10.3 Means of Test a. Select a COM port b. Set the values in Tx or Rx c. Select band and channel d. After setting them all above, press connect button. e. Press the start button Figure 10-1.
  • Page 133 10. STAND ALONE TEST Figure 10-2. HW test setting Figure 10-3. Ramping profile - 134 -...

  • Page 134: Auto Calibration

    11. AUTO CALIBRATION 11. AUTO CALIBRATION 11.1 Overview Autocal (Auto Calibration) is the PC side Calibration tool that perform Tx ,Rx and Battery Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable Power supply). Autocal generate calibration data by communicating with phone and measuring equipment then write it into calibration data block of flash memory in GSM phone.
  • Page 135 11. AUTO CALIBRATION Figure 11-1. Auto Calibration Program Screen > Cable loss : Enter the RF cable loss GSM and DCS Screen > GPIB(Primary address) : Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIB address Screen > ADC Channel : Default ADC Calibration Channel Screen >...

  • Page 136: Agc

    11. AUTO CALIBRATION 11.4 AGC This procedure is for Rx calibration. In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.
  • Page 137 - 138 -...
  • Page 138 - 139 -...

  • Page 139: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 EXPLODED VIEW - 140 -...
  • Page 140 12. EXPLODED VIEW & REPLACEMENT PART LIST - 141 -...
  • Page 141 - 142 -...

  • Page 142: Replacement Parts

    COVER ASSY, ACGH00 ACGH0036901 Black FOLDER(LOWER) MCJH00 COVER,FOLDER(LOWER) MCJH0029301 Lising Black Black MGBY00 GAUZE MGBY0003401 Black MMAA00 MAGNET,SWITCH MMAA0000601 LG-G510,511,512 common use, DIA : 3.0mm+1.5t Silver MPBG00 PAD,LCD MPBG0039101 SGH0.5+SRS0.5 Black MPBZ00 MPBZ0099701 PAD-FPCB Black MPBZ01 MPBZ0115101 PAD_LOWER_WIRE Black MTAD00 TAPE,WINDOW...
  • Page 143 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MCCZ MCCZ0014501 MCJJ00 COVER,FOLDER(UPPER) MCJJ0036401 Lising Black Black MDAD00 DECO,CAMERA MDAD0015201 Black ion plating MGAZ01 GASKET MGAZ0019005 LCD-SIDE-0.5T Black MGAZ02 GASKET MGAZ0020501 3.5X6X1.5 LCD CONN-L Black MGAZ03 GASKET...
  • Page 144 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MCJK00 COVER,FRONT MCJK0047101 Lising Black Black MGAZ00 GASKET MGAZ0020101 IO CONNECTOR-15X3.7X0.3t Gold MGBY00 GAUZE MGBY0003402 GAUZE MIKE Black MIAA00 INDICATOR,LED MIAA0016201 DEEP MICC01 INSERT,FRONT(UPPER) MICC0003201 SILVER MPBZ00 MPBZ0103701...
  • Page 145 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MLEY00 LOCKER MLEY0000801 SIM LOCKER Silver MSDB00 SPRING,COIL MSDB0001701 G7000 Pearl White MTAZ00 TAPE MTAZ0108001 TAPE_REAR_INSULATOR Blue AKAZ00 KEYPAD ASSY AKAZ0012201 GMEY01 SCREW MACHINE,BIND GMEY0002001 1.4 mm,3 mm,MSWR3(BK) ,B ,+ ,HEAD t=0.6, HEAD d2.7 MCCF00 CAP,MOBILE SWITCH...

  • Page 146: Main Component

    ASSY ,8 ohm,92 dB,17 mm,5T SVCY00 CAMERA SVCY0007301 CMOS ,MEGA ,1.3M Magnachip Sensor MAIN ,128*160 ,38.9*49.0*4.0 ,262k ,TFT ,TM SVLM00 LCD MODULE SVLM0015601 ,LGDP4511(LG SYSTEM IC) ,pb free 3.7 ,-9 dBd, ,3.7 ,-9 dBd, SNGF ANTENNA,GSM,FIXED SNGF0010901 ,Internal_Triple(GSM+DCS1800+PCS1900), Pb Free SAFY00 PCB ASSY,MAIN SAFY0146802...
  • Page 147 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C100 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C101 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C102 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C103 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C104 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C105 CAP,CERAMIC,CHIP ECCH0000167...
  • Page 148 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C136 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C137 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C140 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C141 CAP,CERAMIC,CHIP ECCH0000120...
  • Page 149 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C224 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C225 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C226 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C227 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C228 CAP,CERAMIC,CHIP ECCH0000133...
  • Page 150 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C416 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C417 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C418 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C419 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 151 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C523 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP C526 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C527 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C528 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C529 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 152 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C714 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C715 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C717 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C718 CAP,CERAMIC,CHIP ECCH0000122...
  • Page 153 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark FB401 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead FB402 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 , FB403 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 , 900 ,1800.1900 ,3.7 dB,3.8 dB,30 dB,30 dB,ETC FL500 FILTER,SEPERATOR SFAY0006503...
  • Page 154 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R115 RES,CHIP ERHY0000202 4.7 ohm,1/16W,J,1005,R/TP R116 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R117 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R118 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R119 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R200 RES,CHIP ERHY0000241...
  • Page 155 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R325 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R326 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R327 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R328 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R329 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R330 RES,CHIP ERHY0000213...
  • Page 156 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R503 RES,CHIP ERHY0000106 100 ohm,1/16W,F,1005,R/TP R504 RES,CHIP ERHY0000296 1M ohm,1/16W,J,1005,R/TP R505 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R506 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R508 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R600 RES,CHIP ERHY0000280...
  • Page 157 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R724 RES,CHIP ERHY0000125 10K ohm,1/16W,F,1005,R/TP R728 RES,CHIP,MAKER ERHZ0000274 36 Kohm,1/16W ,F ,1005 ,R/TP R729 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R730 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R731 RES,CHIP ERHY0000125 10K ohm,1/16W,F,1005,R/TP SW500...
  • Page 158 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark uCSP ,10 PIN,R/TP ,Dual Analog Switch, 300MHz U702 EUSY0163901 Bandwidth WLCSP ,67 PIN,R/TP ,WLCSP ,67PIN,R/TP U703 EUSY0259801 ,MA5Si2(64POLY MIDI / Internal D-AMP) DFN 3*3*0.9 ,10 PIN,R/TP ,Charger IC, I Max 1A, Wall U704 EUSY0254701 Adaptor/USB Charger...
  • Page 159 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C327 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C328 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C401 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C402 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C741 CAP,CERAMIC,CHIP ECCH0000182...
  • Page 160 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R321 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R335 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R336 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R337 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R338 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R339 RES,CHIP ERHY0000213...
  • Page 161 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R734 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP SC70-5 ,5 PIN,R/TP ,1.8V Low Voltage Comparator with U201 EUSY0077701 Rail-to-Rail Input, Pb Free U400 EUSY0200301 Leadless chip ,6 PIN,R/TP ,Hall S/W, Pb Free U706 EUSY0077301 SC70-6 ,6 PIN,R/TP ,SPDT Analog switch...

  • Page 162: Accessory

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark ADEY00 DATA KIT ADEY0001026 S5100 CD ASSY for CEA MBAZ00 MBAZ0004701 CD Cover...

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