Connecting Equipotential Bonding - Siemens 670 V2 Operating Instructions Manual

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Equipotential bonding requirements
Reduce the differences in potential by laying the equipotential bonding cables in such a way
that the affected electronic components function perfectly. Please comply with the following
guidelines when setting up equipotential bonding:
• The lower the impedance of the equipotential bonding cable, the greater the effectiveness
• When two system parts are connected by means of a shielded signal cable, and their
• Make sure that the diameter of the equipotential bonding cable is proportional to the
• Use equipotential bonding cables made of copper or galvanized steel. Connect the
• Lay the equipotential bonding cable in such a way that the area between the equipotential
6.2.4

Connecting equipotential bonding.

Introduction
Caution
Equipotential bonding cable
Provide adequate cable diameter when setting up PROFIBUS DP networks and MPI
networks. Otherwise interface components will be damaged or destroyed.
Cable shileds are not suitable for the equipotential bonding. Use only the prescribed
equipotential bonding cable. Make sure that the diameter of the equipotential bonding cable
is at least 16 mm².
Procedure
Caution
Please follow the described guidelines concerning equipotential bonding. Otherwise
interface components will be damaged or destroyed.
1. Connect the device to the equipotential bonding as illustrated in the chapter "Connecting
Panel PC 670 V2/870 V2, Control unit
Operating Instructions, Edition 03/2004, CD Documentation and Drivers
of the equipotential bonding.
shields are both connected to the ground or protected conductor, the following must be
observed: The impedance of the additonal equipotential bonding cable amounts to 10 %
of the shield impedance, at the most.
maximum equalization current. Equipotential bonding cables with a 16 mm diameter have
proven themselves in practice. 2.
cables extensively with the ground or protective conductor. Protect the ground or
protective conductor from corrosion.
bonding cable and signal cables is as small as possible.
a decentralized design."
6.2 Connecting a decentralized design
Connecting
6-5

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