Mounting Condition For Bga - Pioneer TS7 Service Manual

Canal plus tuner
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7.4 MOUNTING CONDITION FOR BGA

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1. OMEGA(Programble Transport IC)_STi5512AWE/STi5512AWE/E
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1.1 Resistance classification of solder reflow
The heat-resistance property of solder depends on package design and chip size. The JEDEC (Joint Electron Device
Engineering Council) standards classify and define the term of viability after opening antihumidity packaging until
accomplishment of solder reflow as MSL (Moisture Sensitivity Level).
Note
The MSL classification we employ conforms to JEDEC-STD-020 and JESD22-A112. (The latest revision JEDEC-STD-020A
B
uses more detailed classifications, to which our products do not correspond.)
1.2 Recommended reflow conditions
1.2.1 Recommended temperature profile (IR reflow and hot-air reflow
The recommended temperature profile for IR (infrared) reflow and hot-air reflow is shown in Figure 2.
The number of times of reflow should be three or less.
For IR reflow it is recommended to use a reflow device which uses middle or far infrared radiation.
When compared with middle and far infrared radiation, higher infrared-heat absorption rate on the mold resins and larger heat
stress would be measured with near infrared radiation.
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Temperature (deg.C)
(Temperature on the package surface)
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1.2.2 In the case of VPS
Vapor-phase soldering must be accomplished at an ambient temperature of 215±3 degrees C or less within 30 seconds. To
improve soldering performance, preheating (at 100 to 150 degrees C for 100 to 120 seconds) is recommended, as shown in the
temperature profile for IR reflow.
The number of times of reflow should be three or less.
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MSL
Storage environment
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30deg.C/60%RH
MSL classification
Ramp-Up Rate
3deg.C/sec.Max.
220deg.C
183deg.C
125deg.C
+/- 25deg.C
120sec.Max
Time (Seconds)
Figure 1: Recommended temperature profile (conforming to JEDEC-STD-020)
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TS7, BCT-1710, BCT-1720, BCT-1730
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Term of viability
168 hours
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Max. Temperature
(225deg.C)
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30sec.MAX
120sec.MAX
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Ramp-Down Rate
6deg.C/sec.Max.
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2 9
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2 8
9 9
9 4
2 8
9 9

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