Pioneer TS7 Service Manual page 71

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1.3 Requirements for storage and baking after opening the antihumidity packaging (dry bag)
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If some devices remain in opened packaging because of your product control, it is recommended to store them in a desiccator
(storage box with constant temperature and low humidity less than 20% RH) or promptly reseal the antihumidity packaging after
use.
Heatproof trays (you will see clear "Heat Proof Tray" markings) are employed for some products. If the term of viability after
opening the antihumidity packaging elapses during your manufacturing span, be sure to apply a baking process to the products
with the heatproof tray before mounting the products.
The recommended baking conditions are as follows:
Package 1.8 mm thick or more: at 125 degrees C for 24 hours
Package 1.7 mm thick or more: at 125 degrees C for 12 hours
Package 1.0 mm thick or more: at 125 degrees C for 6 hours
1.4 Analysis of nonconforming items
When you remove our semiconductor products to analyze a nonconforming item, it is recommended to remove them after
baking under the conditions mentioned in paragraph 4 above. If you remove the product using hot air in a status where the
resin has absorbed moisture, heat stress may cause package cracking or adhesion degradation of the resin, and the actual
reason for nonconformity may not found easily.
1.5 Humidity indicator
A humidity indicator as shown in Figure 3, is enclosed in the antihumidity packaging along with our products. If the enclosed
humidity indicator indicates 30% or more when you open the antihumidity packaging, it is likely that the seal of the packaging
has been affected by some mechanical damage during transportation, and moisture must have entered the packaging, causing
the products absorb moisture. In such cases, be sure to perform baking under the conditions mentioned in paragraph 4 above.
If degradation of packaging seal is considered to have occurred before delivery to you, return the products to our representative
or us.
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