LG GD910 Service Manual page 17

3. BB Circuit Technical brief
3.2.1 General description
S-GOLD®3H is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a mixed signal
baseband IC combined with a 3G coprocessor IC, providing all analog and digital functionality for a dual
mode mobile phone in a single chip.
Both ICs building up the S-GOLD®3H SiP are manufactured in infineon Technologies` 1.35V 90nm CMOS
technology to meet the ever increasing demands of the market for feature rich and high performance
terminals at low costs.
The chip will support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD®3H support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external hardware.
3.2.2. Block Description
Processing core
- ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the
Jazelle Java extension for Java acceleration and a MOVE co-processor to accelerate Motion Estimation
algorithms with based video encoding schemes..
- TEAKLite DSP core
ARM9-Memory
- 32k Byte Boot ROM on the AHB
- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 32k Byte Instruction Cache
- 32k Byte Data Cache
- 8k Byte Instruction Tightly coupled Memory (I-TCM)
- 8k Byte Data tightly coupled memory (D-TCM)
TEAKLite®-Memory
- 120k x 16bit Program ROM
- 8k x 16bit Program RAM
- 72k x 16bit Data ROM
- 48k x 16bit Data XRAM
- 5k x 16bit Data YRAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
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GD910 service manual
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Only for training and service purposes