Hitachi C 10FCH2 Handling Instructions Manual page 12

(2) Pow er plug has been rem oved from the receptacle,
When the tool is not in use, keep it stored in a dry
place out of the reach of children.
9. Lubrication
Lubricate the follow ing sliding surfaces once a m onth
to keep the pow er tool in good operating condition
for a long tim e (Fig. 2 and Fig. 27).
Use of m achine oil is recom m ended.
Oil supply points:
* Rotary portion of hinge
* Rotary portion of vise assem bly
Sw itch
(for Laser m arker)
(Only C10FCH2)
Base
10. Cleaning
Periodically rem ove chips, dust and other w aste
m aterial from the surface of the pow er tool, especially
from the inside of the low er guard w ith a dam p, soapy
cloth. To avoid a m alfunction of the m otor, protect it
from contact w ith oil or w ater.
(Only M odel C10FCH2)
If the laser line becomes invisible due to chips and the
like adhered onto the window of the laser marker's light-
emitting section, wipe and clean the window with a dry
cloth or a soft cloth moistened with soapy water, etc.
11. Service parts list
A : Item No.
B : Code No.
C : No. Used
D : Rem arks
CAUTION
Repair, m odification and inspection of Hitachi Pow er
Tools m ust be carried out by a Hitachi Authorized
Service Center.
Especially laser device should be m aintained by the
authorized agent by laser m anufacturer.
Alw ays assign the repair of laser device to Hitachi
Authorized Service Center.
This Parts List w ill be helpful if presented w ith the
tool to the Hitachi Authorized Service Center w hen
requesting repair or other m aintenance.
In the operation and m aintenance of pow er tools, the
safety regulations and standards prescribed in each
country m ust be observed.
12
Trigger sw itch
Nam eplate
Locking pin
Clam p lever
Holder (B)
Fig. 27
M ODIFICATIONS
Hitachi Pow er Tools are constantly being im proved
and m odified to incorporate the latest technological
advancem ents.
Accordingly, som e parts (i.e. code num bers and/or
design) m ay be changed w ithout prior notice.
NOTE
Due to HITACHI's continuing program of research and
developm ent the specifications herein are subject to
change w ithout prior notice.