Specifications - Hitachi C 10FCH2 Handling Instructions Manual

Gloves for handling saw blades (saw blades shall
be carried in a holder w herever practicable) and
rough m aterial.
15. The operator is adequately trained in the use,
adjustm ent and operation of the m achine.
16. Refrain from rem oving any cut-offs or other parts
of the w orkpiece from the cutting area w hilst the
m achine is running and the saw head is not in the
rest position.
17. Never use the com pound m iter saw w ith its low er
guard locked in the open position.
18. Ensure that the low er guard m oves sm oothly.
19. Do not use the saw w ithout guards in position, in
good w orking order and properly m aintained.
20. Use correctly sharpened saw blades. Observe the
m axim um speed m arked on the saw blade.
21. Do not use saw blades w hich are dam aged or
deform ed.
22. Do not use saw blades m anufactured from high
speed steel.
23. Use only saw blades recom m ended by HITACHI.
24. The saw blades should be from 235 m m to 255 m m
external diam eter ranges.
25. Select the correct saw blade for the m aterial to be
cut.
26. Never operate the com pound m iter saw w ith the
saw blade turned upw ard or to the side.

SPECIFICATIONS

M ax. Cutting
Capacity
Height × Width
Saw Blade Dim ensions (oD × iD × Thickness)
M iter Cutting Angle
Bevel Cutting Angle
Com pound Cutting Angle
Voltage (by areas)*
Pow er Input*
No-Load Speed
M achine Dim ensions (Width × Depth × Height)
Weight (Net)
Laser M arker
(Only M odel C10FCH2)
* Be sure to check the nam eplate on product as it is subject to change by areas.
0°
M iter 45°
Bevel Left 45°
Com pound (Bevel Left 45°, M iter 45°)
M axim um output
(Iam bda)
Laser m edium
27. Ensure that the w orkpiece is free of foreign m atter
such as nails.
28. Replace the table insert w hen w orn.
29. Do not use the saw to cut other than alum inium ,
w ood or sim ilar m aterials.
30. Do not use the saw to cut other m aterials than those
recom m ended by the m anufacturer.
31. Blade replacem ent procedure, including the m ethod
for repositioning and a w arning that this m ust be
carried out correctly.
32. Co n n ect t h e co m p o u n d m i t er saw t o a d u st
collecting device w hen saw ing w ood.
33. Take care w hen slotting.
34. When transporting or carrying the tool, do not grasp
the holder. Grasp the handle instead of the holder.
35. Start cutting only after m otor revolution reaches
m axim um speed.
36. Prom ptly cut OFF the sw itch w hen abnorm ality
observed.
37. Shut off pow er and w ait for saw blade to stop before
servicing or adjusting tool.
38. During a m iter or bevel cut the blade should not be
lifted until it has stopped rotation com pletely.
39. Take all the possibility of residual risks in cutting
operation into your consideration, such as the laser
radiation to your eyes, the inadvertent access to
m oving parts on slide m echanical parts on m achine
and so on.
59 m m × 144 m m
89 m m × 101 m m
59 m m × 102 m m
41 m m × 144 m m
41 m m × 102 m m
255 m m × 25.4 m m × 2.7 m m
Right and Left 0° – 52°
M iter (Right and Left) 0° – 45°
(110 V, 220 V, 230 V, 240 V)
460 m m × 628 m m × 561 m m
12 kg (C10FCH2) / 11.9 kg (C10FCE2)
Po<3 m W Class
or
Left 0° – 45°
1520 W
5000 / m in
Laser Product
654 nm
Laser Diode
3