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TABLE 1-1.
EQUIPMENT SPECIFICATION (CONT'O)
Specification
Recordinq
Mode
Bit Density
Rate
Recordinq Heads
Quantity
Read/Write Width
TOP COVEl ASSEMBLY
The top cover assembly protects the drive.
assemblies during customer operations.
The pack cover is opened by means of a latch
under the cover.
An electrical switch
senses the cover is opened, and disables
spindle motor power.
DECX ASSEMBLY
The deck assembly has the following major
subassemblies:
•
A spindle assembly to mount the disk
pack.
Its associated drive motor runs
continuously whenever a pack is in-
stalled, the pack cover is closed, the
START switch is on, and sequence power
(either from the controller or with the
LOCAL/REMOTE switch on the power supply
in the LOCAL position) are available.
•
An actuator assembly that mounts the
read/write heads for processing data.
The actuator contains a voice coil
positioner controlled by a closed-
loop, continuous-feedback servo system
•
A shroud to surround the disk pack.
The shroud: protects the pack, aids
in directing air from the blower to
the
pack~
and prevents the operator
from damaging the read/write heads
with the pack.
•
A read/write chassis to mount logic
cards that
cont~in
logic directly
affecting head selection and operation.
1-4
Value
Modified frequency modulation
(MFM)
4040 bpi (inner track nominal)
6.45 MIIz
(nominal)
20
0.0021 in (nominal) units
•
A first seek interlock assembly to
provide a heads load command delay.
AC POWER SUPPLY
The ac power supply provides ac power re-
quired by the drive.
orhe ac voltages gen-
erated are distributed to the dc power
supply located
in
the logic chassis assembly.
The line filter filters the ac power input
to the power supply.
LOGIC CHASSIS
The logic chassis serves as the mounting
point for the main complement of the logic
cards and dc power supply.
The chassis is
hinge-mounted for easy access to the cards
(which plug in at the inner side of the
chassis) or to the backpanel terminals (at
the outer side).
The backpanel terminals
provide ready access to all signals entering
and leaving each card.
In addition, the
cards have test points for monitoring
cri~
signals within the cards.
The logic chassis also contains a test point
panel that provides a location for status
monitoring of the dc voltages generated by
the dc power panel.
Located in the lower half of the logic chas-
sis is the dc power panel.
The dc power
panel provides dc power required by the
drive.
It also contains relays and solid
state logic used for power sequencing.
83318200
A
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