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1.1
INTRODUCTION............................................................................................................. 1-1
1.2
SPECIFICATIONS ........................................................................................................... 1-2
1.3
EQUIPMENT REQUIRED............................................................................................... 1-2
1.4
CUSTOMER SUPPORT .................................................................................................. 1-3
2.1
INTRODUCTION............................................................................................................. 2-1
2.2
HARDWARE PREPARATION ....................................................................................... 2-1
2.2.1 Clock Select Header (W1) ......................................................................................... 2-4
2.2.2 VDDA Select Header (W2) ....................................................................................... 2-5
2.2.3 Voltage Reference High Select Header (W3)............................................................ 2-6
2.2.4 Voltage Reference Low Select Header (W4)............................................................. 2-7
2.2.5 MCU Clock Source Select Header (W5)................................................................... 2-8
2.2.6
Using a 32 KHz Clock.............................................................................................. 2-9
2.2.7 MCU ID Code Select Header (W6)......................................................................... 2-10
2.2.8 VSSA Insertion Point (E1) ...................................................................................... 2-10
2.3
MEVB CONFIGURATION............................................................................................ 2-11
2.4
ACTIVE PROBE CONFIGURATION........................................................................... 2-13
3.1
INTRODUCTION............................................................................................................. 3-1
3.2
CONFIGURING THE MPFB........................................................................................... 3-1
3.2.1 MPFB Memory Devices ............................................................................................ 3-1
3.2.2 MPFB Jumper Headers.............................................................................................. 3-2
3.4
MEVB INSTALLATION INSTRUCTIONS.................................................................... 3-3
3.4.1 Power Supply - MPFB Connection........................................................................... 3-4
3.4.2 Personal Computer - BDM Connection .................................................................... 3-5
3.5
SOFTWARE INSTALLATION ....................................................................................... 3-5
M68MPB16R1UM/D
Freescale Semiconductor, Inc.
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