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9-2
Suitable
soldering irons
should have temperature
control
and
different
types
of nozzles
(pin
point
tips)
^
e.g.
Weller
Magnastat
WTCP
or
WECP,
Ersa
TC
70/24
V.
If
a higher wattage-rating soldering iron
is
used
on
the etched
circuit
boards
(especially
on
the
RF
-units
),
excessive heat can cause the etched
circuit
wiring
to
separate
from
the board
base
material.
In
general use short-time heating
with
high
tip
temperature
at
a
small point,
avoid long
time
heating.
Chip components
—
Do
not
use
unsoldered chips
again
—
For replacement
take
only
specified
components
—
Do
not
use
any
adhesive to
fix
components
—
Replaced
chips
must
positioned
flat
on
the
pcb
before
soldering
starts
—
Use
only
resin-core solder
tin
with
silver
(60,
36,
4
Ag)
Working
method:
—
Carefully unsolder
both
soldering tags
of the chip
component. Avoid
to
lift
printed
conductor
on
the pcb.
—
Remove
all
superfluous
material.
Use
a
sucking
iron
or sucking
copper
lltze
wire.
—
Locate
the replacement chip exactly
in
place
—
An
additional fixing point
made
by
solder-tin
could be
efficient.
—
Solder each
tag
to the
relevant printed
conductor
on
the
pcb
—
After
a
short
cooling
period
resolder again
the
first
soldered
joint (tension release
of the
chip).
Fig.
14
Replacement
of chip
components
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