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Appendix 1.4.2 Measures for Door
(1) Use metal for all materials configuring the panel.
(2) When joining the door, use a gasket to lower the impedance of the contacting sections, or use a structure
with a large contact area as shown below.
(3) The EMI gasket or conductive packing must contact the metal surface uniformly and at the correct
position.
(a) Use of gasket
Door
EMI gasket
(Note 1) When not using a gasket, ground the control panel grounding with a grounding wire to lower the
door's impedance.
(Note 2) Using screws to fix the plates that have been painted (attachment of packing) is the same as an
insulated state. Peel the paint and fix the screws.
Appendix 1.4.3 Measures for Power Supply
(1) Shield the power supply section and insert a filter to prevent the noise from flowing in or out.
Selection of the noise filter capacity will differ according to the drive unit and devices being used.
Refer to the "EMC Installation Guidelines" (BNP-B8582-45).
Conductive
noise
(Note 1) The conductive noise can be suppressed by inserting a noise filter, but the radiated noise will flow
out.
(Note 2) The conductive and radiated noise can both be suppressed by adding a partition plate to the noise
filter.
(b) Large contact area
Control
panel
Device
Flow out
Radiated
noise
AC input
NF
Conductive
Noise
noise
filter
Appendix 1.4 Panel Structure
Control panel
Door
Contact area
Cross-section drawing
Device
Radiated noise
Partition
AC input
NF
plate
Noise
filter
C70 Connection Manual
87
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