Mounting Method - Sony CXD2701Q Data Book

3)
Mounting method
Soldering
and
severability
(1)
Severability by
JIS
JIS specifies solderability of
an
IC
terminal
(lead)
in
"JIS-C7022
Test
Procedure
A-2".
An
abstract
of this
standard
folfows;
Rosin
flux
must
be used,
and the terminal
must
be dipped
in
it
for
5-10
seconds.
•
H63A
or equivalent solder
must
be
used,
and
the terminal
must
be dipped
in
the
solder
which been
heated
to
230 i
C±5
:
C
for
5±1
seconds,
• Using
a
microscope,
measure
the area
{%)
deposited with
solder.
JIS specifies
that
more
than
95%
of
the
total
area
should be coated with
solder.
(2)
Area
for
soldering
warranty
Soldering
is
warranted
for a specific por-
tion
of
the
terminal.
The
warranted
portion
is
shown
in
the following
figure.
The
tie-bar
cut portion also serves as
a
dam
to
prevent the sealing
resin
flowing out
during device fabrication;
it
is
cut
off at
the
end
of
the process. Since the terminal
is
exposed at the cut-off end, the area
for sol-
dering
is
restricted.
The
portion
near
the
resin
is
often
covered with burrs
when
sealing
with
resin
;
it
is
not
in
the soldering warranty
area.
I
warranty area
for
soldering
device
main
body
tie-bar
cut portion
/
nw
Resistance
to
soldering heat
(1) Specification
of
JIS
JIS specifies the
method
for testing the
resistance to soldering
heat.
This
method
is
used for
guaranteeing the
IC resistance
against thermal stresses by
soldering.
An
abstract
of this
standard
is
as follows:
• Dip the device terminal only
once
for
10±1
seconds
in
a solder bath
of
260'C±5*C,
or for
3±g-
5
seconds
in
a
solder
bath
of
350 C±10'C,
for a
dis-
tance
of
up
to
1
to
1.5
mm
from
the
main
body.
For the solder flow
system temperature
should be
260'C±5'C. To
solder by
soldering iron
temperature
should be
350*C±10"C.
• Leave the device
for
more
than
two
hours
after dipping,
then
measure
the
device characteristics.
• Normally, the warranty
is
limited to
10
seconds
at
260'C±5'C.
The
distance
between
the device
main body and
solder
bath
is
1.6
mm.
-15-