Sony CXD2701Q Data Book page 26

Package
Name
Package name
Package
Features
Symbol
Description Maori:
*
1
Lead
pitch
Lead shape
LC5C
F-
yul direction
'
Standard
D
1
P
DUAL
IN-LINE
PACKAGE
*f0^
P
C
2,
54
mm
(lOOMIL)
Through
Hole
Lead
2 -direction
S
1
P
SINGLE
IN-LINE
PACKAGE
w
P
2.04mm
(11)0
MIL)
Through
Hole
]j3ad
1
-direction
2
t
!'
ZIG-ZAG
IN-LINE
PACKAGE
P
2,54
mm
(100MIU
ZigZag
in-line
Through
Hole
Lead
1
-direct ion
PGA
PIN
GRID
ARRAY
<SJ
c
2,54
mm
(IMMIL)
Through
Hole
Package
under
side.
PIGGY
BACK
PIGGY
BACK
0>
c
2.54mm
(100
MIL)
Through
Hole
Lead
2-direction
Shrink
SDIP
SHRINK
DUAL
IN-LINE
PACKAGE
^^"^
P
LTTBnm
(JIIMIL)
Through
Hole
Lead
2-direction
SZ1P
SHRINK
ZIG-ZAG
IN-LINE.
PACKAGE
p
l.ijfimm
(70MIL)
Hg-Zng
in-line
Through
Hole
Lead
1-direction
8
1
Standard
ilat
package
Q F P
QUAD
FLAT
L-LEADED
PACKAGE
''^^P^
1
'"
p
c
10mm
D.Bmm
D.65mrn
Gull-
Wing
4-direction
SOP
SMALL
OUTLINE
L-LEAUED
PACKAGE
00*
p
L27:nm
(SDMIL)
Gull-
Wing
2-di recti
on
Standard
2-direction
chip carrier
S
J
SMALL
OUTLINE
J-LI-ADED
PACK AUK
0fa
p
1.27
mm
(50
MIL)
J-l ,-..,:!
2-directiors
Shrink
flat
package
VQFP
VEK'l
SMALL
QUAD
FLAT
PACKAGE
p
05mm
Gull.
Wing
4-direction
vsop
VERY
SMALL
OUTLINE
PACKAGE
o
p
0.55mm
Gull-
Wing
2 -direct
Uin
TSOP
THIN
SMALI
OUTLINE
PACKAGE
+
p
0.5mm
(0.55mm)
Gull-
Wing
2-dtreerion
Standard chip
carrier
Q
F
j
QUAD
FLAT
J-LEADEI)
PACKAGE
p
l.27mm
(50MIL)
J
Lead 4-direction
Q
F
K
QUAD
FLAT
NON-LEADED
PACKAGE
c
1.27mm
(50MIL!
Lead leu
Package
under
side
*P
Plastic.
C
Ceramic
-22