3.
Hardware Configurations
Configuration Schematics
MP:
Mid Plane
Board that is located between the front of the enclosure and the rear of the enclosure (the controller
(CM) side)
PSU:
Power Supply Unit
Figure 103 Maximum Configuration Diagram: ETERNUS AF250
CA
CM#0
Memory
CPU
BUD
IOC
SCU
EXP
PSU
IOM#0
EXP
PSU
PANEL:
Operation Panel
CE:
Controller Enclosure
CM:
Controller Module
CA:
Channel Adapter
Host Interface
Memory:
System Memory
BUD:
Bootup and Utility Device
Backup area in case of power outage
•
Storage area for firmware
•
SCU:
System Capacitor Unit
Backup power source in case of power outage
IOC:
I/O Controller
Controller to control I/O
EXP:
SAS Expander
Expander chip for SAS connections
DE:
Drive Enclosure
IOM:
I/O Module
Unit that controls the I/O between controllers and drives
CE
CA
CA
CA
PANEL
CPU
IOC
EXP
MP
DE
PANEL
EXP
MP
FUJITSU Storage ETERNUS AF250 S2, ETERNUS AF250 All-Flash Arrays Design Guide (Basic)
Copyright 2019 FUJITSU LIMITED
CM#1
Memory
BUD
SCU
PSU
IOM#1
PSU
152
P3AG-1822-09ENZ0