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A
= assembly
B
= fan;motor
BT
= battery
C
= capacitor
CR
= diode;diode thyristor;
varactor
DL
= delay line
DS
= annunciator;lamp;LED
E
= misc. electrical part
A
= amperes
A/D
= analog-to-digital
AC
= alternating current
ADJ
= adjust(ment)
AL
= aluminum
AMPL
= amplifier
ANLG
= analog
ANSI
= American National
Standards Institute
ASSY
= assembly
ASTIG
= astigmatism
ASYNCHRO
= asynchronous
ATTEN
= attenuator
AWG
= American wire gauge
BAL
= balance
BCD
= binary-code decimal
BD
= board
BFR
= buffer
BIN
= binary
BRDG
= bridge
BSHG
= bushing
BW
= bandwidth
C
= ceramic;cermet
(resistor)
CAL
= calibrate;calibration
CC
= carbon composition
CCW
= counterclockwise
CER
= ceramic
CFM
= cubic feet/minute
CH
= choke
CHAM
= chamfered
CHAN
= channel
CHAR
= character
CM
= centimeter
CMOS
= complementary metal-
oxide-semiconductor
CMR
= common mode rejec-
tion
CNDCT
= conductor
CNTR
= counter
CON
= connector
CONT
= contact
CRT
= cathode-ray tube
CW
= clockwise
D
= diameter
D/A
= digital-to-analog
DAC
= digital-to-analog
converter
DARL
= darlington
DAT
= data
DBL
= double
DBM
= decibel referenced
to 1mW
DC
= direct current
DCDR
= decoder
DEG
= degree
DEMUX
= demultiplexer
DET
= detector
DIA
= diameter
DIP
= dual in-line package
DIV
= division
DMA
= direct memory access
DPDT
= double-pole,
double-throw
DRC
= DAC refresh controller
DRVR
= driver
Table 5-1. Reference Designator and Abbreviations
REFERENCE DESIGNATOR
F
= fuse
FL
= filter
H
= hardware
J
= electrical connector
(stationary portion);jack
L
= coil;inductor
MP
= misc. mechanical part
P
= electrical connector
(moveable portion);plug
ABBREVIATIONS
DWL
= dowel
ECL
= emitter coupled logic
ELAS
= elastomeric
EXT
= external
F
= farads;metal film
(resistor)
FC
= carbon film/
composition
FD
= feed
FEM
= female
FF
= flip-flop
FL
= flat
FM
= foam;from
FR
= front
FT
= gain bandwidth
product
FW
= full wave
FXD
= fixed
GEN
= generator
GND
= ground(ed)
GP
= general purpose
GRAT
= graticule
GRV
= groove
H
= henries;high
HD
= hardware
HDND
= hardened
HG
= mercury
HGT
= height
HLCL
= helical
HORIZ
= horizontal
HP
= Hewlett-Packard
HP-IB
= Hewlett-Packard
Interface Bus
HR
= hour(s)
HV
= high voltage
HZ
= Hertz
I/O
= input/output
IC
= integrated circuit
ID
= inside diameter
IN
= inch
INCL
= include(s)
INCAND
= incandescent
INP
= input
INTEN
= intensity
INTL
= internal
INV
= inverter
JFET
= junction field-
effect transistor
JKT
= jacket
K
= kilo(103)
L
= low
LB
= pound
LCH
= latch
LCL
= local
LED
= light-emitting
diode
LG
= long
LI
= lithium
LK
= lock
LKWR
= lockwasher
LS
= low power Schottky
LV
= low voltage
M
= mega(106);megohms;
meter(distance)
MACH
= machine
MAX
= maximum
HP 16532A - Replaceable Parts
Q
= transistor;SCR;
triode thyristor
R
= resistor
RT
= thermistor
S
= switch;jumper
T
= transformer
TB
= terminal board
TP
= test point
MFR
= manufacturer
MICPROC
= microprocessor
MINTR
= miniature
MISC
= miscellaneous
MLD
= molded
MM
= millimeter
MO
= metal oxide
MTG
= mounting
MTLC
= metallic
MUX
= multiplexer
MW
= milliwatt
N
= nano(10-9)
NC
= no connection
NMOS
= n-channel metal-
oxide-semiconductor
NPN
= negative-positive-
negative
NPRN
= neoprene
NRFR
= not recommended for
field replacement
NSR
= not separately
replaceable
NUM
= numeric
OBD
= order by description
OCTL
= octal
OD
= outside diameter
OP AMP
= operational amplifier
OSC
= oscillator
P
= plastic
P/O
= part of
PC
= printed circuit
PCB
= printed circuit board
PD
= power dissipation
PF
= picofarads
PI
= plug in
PL
= plate(d)
PLA
= programmable logic
array
PLST
= plastic
PNP
= positive-negative-
positive
POLYE
= polyester
POS
= positive;position
POT
= potentiometer
POZI
= pozidrive
PP
= peak-to-peak
PPM
= parts per million
PRCN
= precision
PREAMP
= preamplifier
PRGMBL
= programmable
PRL
= parallel
PROG
= programmable
PSTN
= position
PT
= point
PW
= potted wirewound
PWR
= power
R-S
= reset-set
RAM
= random-access
memory
RECT
= rectifier
RET
= retainer
RF
= radio frequency
RGLTR
= regulator
RGTR
= register
RK
= rack
RMS
= root-mean-square
U
= integrated circuit;
microcircuit
V
= electron tube; glow
lamp
VR
= voltage regulator;
breakdown diode
W
= cable
X
= socket
Y
= crystal unit(piezo-
electric or quartz)
RND
= Round
ROM
= read-only memory
RPG
= rotary pulse generator
RX
= receiver
S
= Schottky-clamped;
seconds(time)
SCR
= screw;silicon
controlled rectifier
SEC
= second(time);secon-
dary
SEG
= segment
SEL
= selector
SGL
= single
SHF
= shift
SI
= silicon
SIP
= single in-line
package
SKT
= skirt
SL
= slide
SLDR
= solder
SLT
= slot(ted)
SOLD
= solenoid
SPCL
= special
SQ
= square
SREG
= shift register
SRQ
= service request
STAT
= static
STD
= standard
SYNCHRO
= synchronous
TA
= tantalum
TBAX
= tubeaxial
TC
= temperature coefficient
TD
= time delay
THD
= thread(ed)
THK
= thick
THRU
= through
TP
= test point
TPG
= tapping
TPL
= triple
TRANS
= transformer
TRIG
= trigger(ed)
TRMR
= trimmer
TRN
= turn(s)
TTL
= transistor-transistor
TX
= transmitter
U
= micro(10-6)
UL
= Underwriters
Laboratory
UNREG
= unregulated
VA
= voltampere
VAC
= volt,ac
VAR
= variable
VCO
= voltage-controlled
oscillator
VDC
= volt,dc
VERT
= vertical
VF
= voltage,filtered
VS
= versus
W
= watts
W/
= with
W/O
= without
WW
= wirewound
XSTR
= transistor
ZNR
= zener
oC
= degree Celsius
(Centigrade)
oF
= degree Fahrenheit
oK
= degree Kelvin
5-3
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