TABLE OF CONTENTS
1.
Making Calls ................................................................... 8
Receiving Calls ............................................................... 10
2.
......................................................... 23
3.
Base Unit ......................................................................... 26
Handset ............................................................................ 29
4.
4-6. Schematic Diagram
- BASE MAIN (1/2)/BASE MIC Boards - ................... 43
4-7. Schematic Diagram - BASE MAIN Board (2/2) - ........ 45
4-9. Schematic Diagram
- BASE KEY/KEY LED Boards - ................................. 49
5.
6.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
................................................ 62
............................... 65
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
- 2 -