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d) Remove one screw securing earth wire comming
from operation panel. (Fig. 6-5)
e) Turnover the unit and remove the operation panel.
f) Remove four screws securing the reverse side
cover. (Fig. 6-7)
g) Remove the connectors
CN21 and CN22 located
on the OPE PCB (M-2). (Fig. 6-8)
h) Remove nine screws securing OPE PCB (M-2)
and two screws securing MIC PCB (M-9)
(only for the SFX-21O) (Fig. 6-8)
i) Remove two screws securing LCD. (Fig. 6-8)
(7) Removal of the PAPER SENSOR PCB
a) Remove the back lid.
(Refer to the procedure the 6-1-(2))
b) Remove the connector
CN9 located on the main
PCB (M-1) and remove PAPER SENSOR PCB
(M-8). (Fig. 6-9)
L
6-2. Replacement
of the main parts
.—
(1) Replacement
of the contact Image Sensor
a) Remove the cabinet. (Refer to the procedure
6-l-(l))
b) Remove the main PCB(M-1 ). (Refer to the
procedure 6-1 (3))
c) Remove one screw securing the metal bracket for
ADF unit. (Fig. 6-10)
d) Rotate the shaft of the reading roller to the arrow
direction and remove platen CIS. (Fig. 6-11)
e) Remove CIS
(2) Replacement
of the Thermal Head
a) Remove the original document tray.
b) Open the operation panel and recording paper
cover.
c) Remove two screws securing the recording paper
cover and remove the attachment
unit for the
thermal head. (Fig. 6-1 2)
d) Remove two plate spring using screw driver(-).
(Fig. 6-13)
f) Remove two screws securing thermal head.
When attaching thermal head to the bracket head,
the thermal head should be pressed to the arrow
direction. (Fig. 6-14)
PAPER SENSOR PCB
Metal blacket
1 screw securin~
the earh wire
4
screws securing MAIN PCB
FIG.
6-5
MAIN PCB
FIG. 6-6
['
;l +
h~ i
—
.----J_.
.
,
_
i
.—
r .—
/1,
,,,
---
,
,"
'=J :
_ _J
,—
\\\!l
...
!..
!b
4 screws securing the reverse side cover
FIG.
6-7
2
screws securing the LCD
[F-J
%5
!'[+2
LCD
l!
~-
0
~
,..
,;
,
!l~
MIC PCB
J
':-
0,,,
,CB
-:"'>
d
FIG. 6-8
~ 9 screws securing
the OPE. PCB
FIG.
6-9
I
U
28
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Troubleshooting
