Power Supply Features; Input Power Supply - Huawei MU709 Series Hardware Manual

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Table 5-2 Operating and storage temperatures for the MU709 module
Specification
Normal working temperatures
Extended temperatures
Ambient temperature for storage
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5.4 Power Supply Features

5.4.1 Input Power Supply

Table 5-3 Requirements for input power for the MU709 module
Parameter
VCC_3V3
Figure 5-1 Power Supply During Burst Emission
The VCC_3V3 minimum value must be guaranteed during the burst (with 2.7 A Peak in GSM 2
slot mode). So a low-dropout (LDO) regulator or switch power with current output of more than
3.5 A is strongly recommended for external power supply.
Table 5-4 Requirements for input current of the MU709 module
Power
VCC_3V3
[1]: When the ME909s LGA module works in the range from –30°C to –20°C or +70°C to
+75°C, NOT all their RF performances comply with 3GPP specifications.
The thermal design must be implemented according to the chapter 6.7 Thermal Design
Guide. If not, the overheat protection mechanism will be triggered due to overheated Mini
PCIe and the network connection will be terminated.
Min. Typ.
3.0 3.3
Module Peak (GSM 2 slot)
MU709 2750 mA
Electrical and Reliability Features
Min.
–20
–30
–40
Max.
3.6
Normal (WCDMA)
1100 mA
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd
Issue 04 (2015-06-25)
Max. Unit
+70 °C
+75 °C
+85 °C
Ripple Unit
0.05 V
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