Reliability Features - Huawei MU709 Series Hardware Manual

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide



5.5 Reliability Features

Table 5-9 lists the test conditions and results of the reliability of the MU709 module.
Table 5-9 Test conditions and results of the reliability of the MU709 module
Item
Stress Low-temperature
storage
High-temperature
storage
Low-temperature
operating
High-temperature
operating
Damp heat
cycling
All power consumption test configuration can be referenced by GSM Association Official
Document TS.09: Battery Life Measurement and Current Consumption Technique.
Test condition: For Max. Tx. power, see 4.4.2 Conducted Transmit Power, which are listed in
Table 4-5 ; for Max. data throughput, see 2.2 Function Overview, which are listed in Table
2-1 .
Test Condition
 Temperature: –40ºC
 Operation mode: no
power, no package

Test duration: 24 h

Temperature: 85ºC
 Operation mode: no
power, no package
 Test duration: 24 h

Temperature: –30ºC

Operation mode:
working with service
connected
 Test duration: 24 h
 Temperature: 70ºC
 Operation mode:
working with service
connected

Test duration: 24 h

High temperature:
55ºC

Low temperature:
25ºC
 Humidity: 95%±3%
 Operation mode:
working with service
connected

Test duration: 6
cycles; 12 h+12
h/cycle
Electrical and Reliability Features
Standard Sample size
JESD22- 3 pcs/group
A119-C
JESD22- 3 pcs/group
A103-C
IEC60068 3 pcs/group
-2-1
JESD22- 3 pcs/group
A108-C
JESD22- 3 pcs/group
A101-B
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd
Issue 04 (2015-06-25)
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
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