Huawei MU709 Series Hardware Manual page 43

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
Item
Drop test
Life High temperature
operating life
High temperature
& high humidity
Temperature
cycle
ESD HBM (Human
Body Model)
Test Condition
 0.8 m in height. Drop
the module on the
marble terrace with
one surface facing
downwards. Six
surfaces should be
tested.

Operation mode: no
power, no package
 Temperature: 70ºC
 Operation mode:
working with service
connected
 Test duration: 168 h,
336 h, 500 h for
inspection point

High temperature:
85ºC
 Humidity: 85%
 Operation mode:
powered on and no
working
 Test duration: 168 h,
336 h, 500 h for
inspection point
 High temperature:
85ºC
 Low temperature:
–40ºC

Temperature change
slope: 6ºC/min
 Operation mode: no
power
 Test duration: 168 h,
336 h, 500 h for
inspection point
 2 kV (Class 1B)
 Operation mode: no
power
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd
Issue 04 (2015-06-25)
Electrical and Reliability Features
Standard Sample size
IEC60068 3 pcs/group
-2-32
JESD22- 50 pcs/group
A108-B
JESD22- 50 pcs/group
A110-B
JESD22- 50 pcs/group
A104-C
JESD22- 3 pcs/group
A114-D
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Cross section: ok
Visual inspection: ok
Function test: ok
RF specification:
ok
Cross section: ok
Visual inspection: ok
Function test: ok
RF specification: ok
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