Huawei ME909 Series Hardware Manual page 21

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
PIN Pin Name
No.
Normal
129 GND
130 GND
131 GND
132 GND
133 GND
134 GND
135 GND
136 GND
137 GND
138 GND
139 GND
140 GND
141 GND
Issue V0.3 (2013-05-21)
I/O Description
MUX
- - Thermal Ground Pad,
this pad need thermal
via
- - Thermal Ground Pad,
this pad need thermal
via
- - Thermal Ground Pad,
this pad need thermal
via
Thermal Ground Pad,
- -
this pad need thermal
via
- - Thermal Ground Pad,
this pad need thermal
via
- - Thermal Ground Pad,
this pad need thermal
via
- - Thermal Ground Pad,
this pad need thermal
via
Thermal Ground Pad,
- -
this pad need thermal
via
- - Thermal Ground Pad,
this pad need thermal
via
- - Thermal Ground Pad,
this pad need thermal
via
- - Thermal Ground Pad,
this pad need thermal
via
Thermal Ground Pad,
- -
this pad need thermal
via
- - Thermal Ground Pad,
this pad need thermal
via
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
DC Characteristics (V)
Min. Typ.
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Max.
-
-
-
-
-
-
-
-
-
-
-
-
-
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