Preparing The Mounting Cutout - Siemens SIMATIC IFP Basic Series Operating Instructions Manual

Installing and connecting the device
3.1 Preparing for installation
● Vertical installation: display turned through ±90 ° compared with the standard position
For vertical installation, the following ambient temperatures are permitted:
3.1.4

Preparing the mounting cutout

Note
Stability of the mounting cutout
The material in the area of the mounting cutout must provide sufficient strength to guarantee
the enduring and safe mounting of the device.
To achieve the degrees of protection described below, it must be ensured that deformation
of the material cannot occur due to the force of the mounting clips or operation of the device.
Degrees of protection
The degrees of protection of the device can only be guaranteed if the following requirements
are met:
● In order to achieve IP65 protection degree, the material thickness for the mounting cutout
should be: 2 mm to 6 mm
● Permissible deviation from plane at the mounting cutout: ≤ 0.5 mm
This condition must be fulfilled for the mounted device.
● Permissible surface roughness in the area of the seal: ≤ 120 µm (R
22
Maximum ambient temperature at the
device
45 °C (IFP1200 Basic, IFP1500
Basic, IFP1900 Basic)
40 °C (IFP2200 Basic)
Comment
The device must be installed in a fire protection enclosure
(see "General safety instructions (Page 12)").
Operating Instructions, 03/2019, A5E46178354 - AB
120)
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IFP Basic