Preparing The Mounting Cutout - Siemens SIMATIC IFP1200 Basic Operating Instructions Manual

For vertical installation, the following ambient temperatures are permitted:
3.1.4

Preparing the mounting cutout

Note
Stability of the mounting cutout
The material in the area of the mounting cutout must provide sufficient strength to
guarantee the enduring and safe mounting of the device.
To achieve the degrees of protection described below, it must be ensured that deformation of
the material cannot occur due to the force of the mounting clips or operation of the device.
Degrees of protection
The degrees of protection of the device can only be guaranteed if the following requirements
are met:
• For SIMATIC IFP Basic and SIMATIC IFP1200 Basic C, in order to achieve IP65 protection
degree, the material thickness for the mounting cutout should be: 2 mm to 6 mm
• Permissible deviation from plane at the mounting cutout: ≤ 0.5 mm
This condition must be fulfilled for the mounted device.
• Permissible surface roughness in the area of the seal: ≤ 120 µm (R
IFP Basic
Operating Instructions, 06/2023, A5E46178354 - AD
Maximum ambient temperature at
the device
45 °C (IFP1200 Basic, IFP1500 Basic,
IFP1900 Basic)
40 °C (IFP2200 Basic)
50°C (IFP1200 Basic C)
Installing and connecting the device
Comment
The device must be installed in a fire protection enclosure
(see "General safety instructions (Page 13)").
The device enclosure fulfills the requirement of a fire
protection enclosure.
3.1 Preparing for installation
120)
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23