Huawei MU709 Series Hardware Manual page 22
Hspa+ lga module
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Also See for MU709 Series:
- Hardware manual (63 pages) ,
- Design manual (18 pages) ,
- Development kit manual (35 pages)
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HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
Pin
Pad
Pin Name
No.
Type
110
GND
-
111
NC
-
112
GND
-
113
GPIO3/Jam
I/O
ming-detecti
on
114
GND
-
115
AUX_ANT
-
116
GND
-
117
NC
-
118
NC
-
119
NC
-
120
NC
-
121
GND
-
122
GND
-
123
GND
-
124
GND
-
125
GND
-
126
GND
-
127
GND
-
128
GND
-
129
GND
-
130
GND
-
131
GND
-
Issue 09 (2017-12-15)
Description
pins.
Ground
Not connected
Ground
General Purpose I/O pins
(Default) or
Jamming-detection.
Ground
RF AUX antenna pad
Ground
Not connected
Not connected
Not connected
Not connected
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Thermal Ground Pad
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
Min.
Typ.
Parameter
(V)
(V)
V
0
-
OL
V
1.26
1.8
IH
–0.3
V
-
IL
-
-
-
-
-
-
-
-
-
V
1.35
1.8
OH
V
0
-
OL
V
1.26
1.8
IH
–0.3
V
-
IL
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Max.
Comments
(V)
this pin has not
0.45
been defined.
2.1
0.63
-
-
-
-
-
-
2.1
The function of
this pin can be
defined as GPIO
0.45
or
Jamming-detecti
on, while the
2.1
Jamming-detecti
on should be
0.63
enabled by AT
command.
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
22
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