Assembly Processes; Overview; Stencil Design; Reflow Profile - Huawei MU709 Series Hardware Manual

Hspa+ lga module

Hide thumbs Also See for MU709 Series:

Table of Contents

HUAWEI MU709 Series HSPA+ LGA Module

Hardware Guide

6.8 Assembly Processes



It is recommended that the stencil for the LGA module be 0.15 mm in thickness. For

the stencil design, see the following figure:

Figure 6-7 Recommended stencil design of LGA module (unit: mm)

The LGA module must be reflowed on the top side of customer's development board.

For the soldering temperature of the LGA module, see the following figure.

Issue 09 (2017-12-15)

Tray modules are required at SMT lines, because LGA modules are placed on

ESD pallets.

Reflow ovens with at least seven temperature zones are recommended.

Use reflow ovens or rework stations for soldering, because LGA modules have

large solder pads and cannot be soldered manually.

The stencil design has been qualified for HUAWEI motherboard assembly, customers can

adjust the parameters by their motherboard design and process situation to assure LGA

soldering quality and no defect.

Huawei Proprietary and Confidential

Mechanical Specifications

Table of Contents

Mu709s-6 Mu709s-2