Huawei MU709 Series Hardware Manual page 6

HUAWEI MU709 Series HSPA+ LGA Module
Hardware Guide
3.12 Reserved Interface ....................................................................................................................... 44
3.13 NC Interface ................................................................................................................................. 44
3.14 Test Points Design ........................................................................................................................ 45
4 RF Specifications ......................................................................................................................... 46
4.1 About This Chapter ......................................................................................................................... 46
4.2 Operating Frequencies ................................................................................................................... 46
4.3 Conducted RF Measurement ......................................................................................................... 47
4.3.1 Test Environment ................................................................................................................... 47
4.3.2 Test Standards ....................................................................................................................... 47
4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 47
4.4.1 Conducted Receive Sensitivity .............................................................................................. 47
4.4.2 Conducted Transmit Power ................................................................................................... 48
4.5 Antenna Design Requirements ...................................................................................................... 49
4.5.1 Antenna Design Indicators..................................................................................................... 49
4.5.2 Interference ........................................................................................................................... 52
4.5.3 Antenna Requirements .......................................................................................................... 52
5 Electrical and Reliability Features ........................................................................................... 54
5.1 About This Chapter ......................................................................................................................... 54
5.2 Absolute Ratings ............................................................................................................................ 54
5.3 Operating and Storage Temperatures and Humidity ...................................................................... 54
5.4 Power Supply Features .................................................................................................................. 55
5.4.1 Input Power Supply ............................................................................................................... 55
5.4.2 Power Consumption .............................................................................................................. 56
5.5 Reliability Features ......................................................................................................................... 60
5.6 EMC and ESD Features ................................................................................................................. 63
6 Mechanical Specifications ......................................................................................................... 65
6.1 About This Chapter ......................................................................................................................... 65
6.2 Storage Requirement ..................................................................................................................... 65
6.3 Moisture Sensitivity ........................................................................................................................ 65
6.4 Dimensions and Interfaces ............................................................................................................. 66
6.5 Packaging ....................................................................................................................................... 66
6.6 Customer PCB Design ................................................................................................................... 68
6.6.1 PCB Surface Finish ............................................................................................................... 68
6.6.2 PCB Pad Design .................................................................................................................... 69
6.6.3 Solder Mask ........................................................................................................................... 69
6.6.4 Requirements on PCB Layout ............................................................................................... 69
6.7 Thermal Design Solution ................................................................................................................ 70
6.8 Assembly Processes ...................................................................................................................... 72
6.8.1 Overview ................................................................................................................................ 72
6.8.2 Stencil Design ........................................................................................................................ 72
6.8.3 Reflow Profile ........................................................................................................................ 72
Issue 09 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Contents
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