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Moto G (4th Generation)
Level 2 – Service and Repair Manual
PCB ZIF Pad Assembly
Description
ASSY,PWA,ATHENE,XCVR EMEA/APAC,2G/16G
ASSY,PWA,ATHENE,XCVR INDIA,2G/16G
ASSY,PWA,ATHENE,XCVR INDIA,3G/32G
ASSY,PWA,UMTS/LTE EMEA, 2GB/16GB, BOARD
ASSY,PWA,ATHENE,XCVR EMEA/APAC,3G/32G
ASSY,PWA,ATHENE,NA,4G/64G
ASSY,PWA,UMTS/LTE BRAZIL, 2GB/16GB, DTV, BOARD-KIT, ATHENE-13
ASSY,PWA,ATHENE,XCVR NA,2G/16G
ASSY,PWA,WE/LTE NA, SNGL SIM, 2GB/32GB,
ASSY,PWA,WE/LTE NA, SNGL SIM, 2GB/16GB,
ASSY,PWA,ATHENE,XCVR ROLA,2G/32G
ASSY,PWA,ATHENE,XCVR BRAZIL,2G/32G
ASSY,PWA,UMTS/LTE INDIA, 2GB/16GB, BOARD
ASSY,PWA,ATHENE,XCVR EMEA/APAC,2G/32G
ASSY,PWA,UMTS/LTE LATAM, 2GB/16GB, BOARD
PAD,ZIF LANDING,MAIN IMGR
PAD,ZIF LANDING,FF,CAMERA
PAD,ZIF LANDING,HSJ
1.
Remove the Rear-Facing Imager Flex ZIF
Pad from the carrier.
2.
Place the Rear-Facing Imager Flex ZIF Pad
on the PCB in the location shown.
3.
Press down on the Rear-Facing Imager Flex
ZIF Pad for 5 seconds to secure the Pad to
the PCB.
4.
Remove the Front-Facing Imager Flex ZIF
Pad from the carrier.
5.
Place the Front-Facing Imager Flex ZIF Pad
on the PCB in the location shown.
6.
Press down on the Front-Facing Imager Flex
ZIF Pad for 5 seconds to secure the Pad to
the PCB.
PAGE 60
Reference #
2
17
20
15
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