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Philips Semiconductors
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
y
Z
28
pin 1 index
1
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
A
1
max.
0.15
0.95
mm
1.10
0.05
0.80
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT361-1
Fig 24. TSSOP28 package outline.
9397 750 09238
Product data
D
b
e
0
(1)
A
b
c
D
2
3
p
0.30
0.2
9.8
0.25
0.19
0.1
9.6
REFERENCES
IEC
JEDEC
MO-153
Rev. 08 — 20 December 2001
USB interface device with parallel bus
c
15
A
2
A
1
14
w
M
p
2.5
5 mm
scale
(2)
E
e
H
L
E
4.5
6.6
0.75
0.65
1.0
4.3
6.2
0.50
EIAJ
PDIUSBD12
E
A
H
E
Q
(A )
3
L
p
L
detail X
L
Q
v
w
y
p
0.4
0.2
0.13
0.1
0.3
EUROPEAN
PROJECTION
© Koninklijke Philips Electronics N.V. 2001. All rights reserved.
SOT361-1
X
v
A
M
A
θ
(1)
θ
Z
o
0.8
8
o
0.5
0
ISSUE DATE
95-02-04
99-12-27
30 of 35
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