Siemens SIMATIC S7-1500 System Manual page 9

5 Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . 63
5.1 Rules and regulations for operation ................................................................................ 63
5.2 Additional rules and regulations for operation of the S7-1500/ET 200MP with fail-safe
modules ........................................................................................................................ 65
5.2.1 Safe functional extra-low voltage (SELV) for fail-safe modules.......................................... 65
5.2.2 Requirements of sensors and actuators for fail-saf e modules ........................................... 66
5.2.3 Capacitive crosstalk of digital input/output signals ............................................................ 68
5.3 Operation on grounded infeed ........................................................................................ 69
5.4 Electrical configuration ................................................................................................... 72
5.5 Wiring rules ................................................................................................................... 75
5.6 Connecting the supply voltage........................................................................................ 80
5.7 Connecting system power supply and load current supply ................................................ 81
5.8 Connecting the CP U/interface module to the load current supply ...................................... 83
5.9 Connecting interfaces for communication ........................................................................ 85
5.10 Front connector for the I/O modules ................................................................................ 85
5.10.1 Wiring front connectors for I/O modules without shield contact element ............................. 88
5.10.2 Wiring front connectors for I/O modules with shield contact element ................................. 90
5.10.3 Bringing the front connector into final position.................................................................. 96
5.11 Marking the I/O modules ................................................................................................ 98
5.11.1 Labeling strips ............................................................................................................... 98
5.11.2 Optional marking ........................................................................................................... 99
6 Configuring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . 100
6.1 Configuring the CPU .....................................................................................................100
6.1.1 Reading out the configuration ........................................................................................101
6.1.2 Address assignment .....................................................................................................106
6.1.2.1 Addressing - overview...................................................................................................106
6.1.2.2 Addressing digital modules............................................................................................108
6.1.2.3 Addressing analog modules ..........................................................................................110
6.1.3 Process images and process image partitions ................................................................112
6.1.3.1 Process image - overview .............................................................................................112
6.1.3.2 Assign process image partitions to an OB ......................................................................113
6.1.3.3 Update process image partitions in the user program......................................................114
6.2 Configuring ET 200MP distributed I/O system ................................................................115
6.3 Assigning PROFIsaf e address to fail-safe modules with S IMATIC Safety .........................116
7 Basics of program execution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . 117
7.1 Events and OBs ...........................................................................................................117
7.2 CPU overload behavior .................................................................................................120
7.3 Asynchronous instructions ............................................................................................121
Automation system
System Manual, 09/2016, A5E03461182-AD
Table of contents
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