Huawei TaiShan 200 Product White Paper page 22

TaiShan 200 Server
White Paper (Model 2180)
Figure 4-12 Components
1
3
5
7
9
11
13
15
17
Issue 02 (2020-06-22)
I/O module 1
PSUs
Supercapacitor bracket
Front drive backplane
Fan modules
Cable organizers
DIMMs
RAID controller card
iBMC card
● I/O module 1 can be configured with a rear drive module with two 2.5-inch drives or a
PCIe riser module (PRM). I/O module 2 can be configured with a rear drive module with
two 2.5- or 3.5-inch drives. I/O module 3 cannot be used.
● The FlexIO can be configured with a TM210 NIC.
● CPU is integrated on the mainboard and cannot be replaced independently.
Copyright © Huawei Technologies Co., Ltd.
4 Hardware Description
2 I/O module 2
4 Chassis
6 Air duct
8 Fan module brackets
10 Front drives
12 Heat sinks
14 Mainboard
16 FlexIO
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19