Parameter Summary - Epson Power Supply IC S1F70000 Technical Manual

Appendix
The following figure shows a thermal design
model which can be used to determine heatsink
capacity.
Heat
source

PARAMETER SUMMARY

Symbol
C Drain capacitance
D
C Field slew capacitance
F8
C Gate capacitance
G
C Input capacitance
I
C Capacitance
n
CT Crosstalk
C Temperature gradient
Tn
f Clock frequency
CLK
f Maximum clock frequency
max
f Oscillator frequency
OSC
FT Field through (channel OFF)
I Backup switching leakage current
BSQ
I Operating current
DDO
I Standby current
DDS
I Power supply current
DD
I High-level input current
IH
I Low-level input current
IL
I input leakage current
LKI
I Maximum current
MAX
I Output current
O
I High-level output current
OH
I Low-level output current
OL
I Multiplier circuit power dissipation
OPR1
6–2
Junction
T
temperature
j
jc
Case
T
c
temperature
cs
Heatsink
T
s
temperature
sa
Ambient
T
a
temperature
Parameter
2. Ensure that the regulator common pin is a sin-
gle-point ground to prevent earth loops. Make
ground lines as thick and short as possible. Use the
specified bypass capacitors for inputs and outputs.
If there is a switching load, use a tantalum or
ceramic capacitor, as these devices have a high
frequency response between the power supply and
ground.
Symbol
I
OPR2
I
Q
I
R
I
SWQ
K
I
P
D
P
eff
R
BSON
R
L
R
O
R
ON
R
OSC
R
RV
R
RVn
R
SAT
R
SWON
T
a
t
AE
t
HA
t
HD
THD
jn
t
MRR
EPSON
Parameter
Stabilization circuit power dissipation
Quiescent current
Reverse current
Switching transistor leakage current
Output voltage temperature gradient
Power dissipation
Voltage multiplication efficiency
Backup switch ON resistance
Load resistance
Output impedance
ON resistance
Oscillator network resistor
Stabilization voltage sensing resistor
Reference voltage
Stabilization output saturation resistance
Switching transistor ON resistance
Ambient temperature
Minimum pulsewidth
Address hold time
Data hold time
Total harmonic distortion
Thermal resistance
Memory reset recovery time
S1F70000 Series
Technical Manual