Chip External Shape And Pad Center Coordinates - Epson Power Supply IC S1F70000 Technical Manual

S1F76640 Series

CHIP EXTERNAL SHAPE AND PAD CENTER COORDINATES

Chip External Shape
Y
+
(0,0)
2.30mm
Figure 4-4 Pad Assignments
(x)
Chip size : 2.30mm 2.60mm 0.30mm
PAD aperture : 100 m
DIE number : F76640D0A0
2–42
X
(y) (t)
100 m
Pad Center Coordinates
S1F7664D0A0
Pad
No. Name
1
2 V
3 (TESTOUT)
4 TC1
5 TC2
6 P
7 GND
8 OSC1
9 OSC2
10 V
11 CAP1–
12 CAP1+
13 CAP2–
14 CAP2+
15 CAP3+
16
17
EPSON
Pad Center Coordinates
X[ m]
RV –984.0
REG
OFF
984.0
DD
V
O
V
RI
Y[ m]
1096.0
788.0
580.0
390.0
96.0
–218.0
–510.0
–802.0
–1094.0
–1134.0
–892.0
–514.0
182.0
372.0
750.0
942.0
1134.0
S1F70000 Series
Technical Manual