Taping Information - Epson Power Supply IC S1F70000 Technical Manual

Appendix
EMBOSS CARRIER TAPING STANDARD (SOP3-8pin )

TAPING INFORMATION

The emboss carrier taping standard is shown in the
following table and figure. This standard conforms to
Dimension code
A
B
D
D1
E
F
P1
P0
T
W1
T2
There are no joints in either the cover or carrier tapes.
Less than 0.2% of the total device count is comprised
of non-sequential blanks. There are no sequential
6–8
Dimensions/angles (mm/ )
6.7
5.4
1.55 +0.05, –0
1.55 0.05
1.75 0.1
5.5 0.1
8.0 0.1
4.0 0.1
Index mark
the EIAJ RCI009B electronic parts taping specification.
Each tape holds 2,000 devices.
Dimension code
P2
T
T2
W
W1
Note
The tape thickness is 0.1 mm Max.
A
B
P1
TE2
blanks. This does not apply to the tape leader and
trailer.
EPSON
Dimensions/angles (mm/ )
2.0 0.05
0.3 0.05
12.0 0.3
15 Max.
P0
D
P1
Travel direction
2.5
9.5
E
F
W
D1
S1F70000 Series
Technical Manual