Equipotential Bonding - Siemens SIMATIC RF610T ATEX System Manual

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RF600 system planning
4.10 Guidelines for electromagnetic compatibility (EMC)
I I nterference source
HF interference over the
antennas
4 4 .10.5

Equipotential bonding

Potential differences between different parts of a plant can arise due to the different design
of the plant components and different voltage levels. If the plant components are connected
across signal cables, transient currents flow across the signal cables. These transient
currents can corrupt the signals.
Proper equipotential bonding is thus essential.
The equipotential bonding conductor must have a sufficiently large cross section (at least
10 mm
The distance between the signal cable and the associated equipotential bonding
conductor must be as small as possible (antenna effect).
A fine-strand conductor must be used (better high-frequency conductivity).
When connecting the equipotential bonding conductors to the centralized equipotential
bonding strip (EBS), the power components and non-power components must be
combined.
The equipotential bonding conductors of the separate modules must lead directly to the
equipotential bonding strip.
Figure 4-20
102
C C ause
caused by another reader
2
).
Equipotential bonding (EBS = Equipotential bonding strip)
R R emedy
Position the antennas further
apart.
Erect suitable damping materials
between the antennas.
Reduce the power of the readers.
Please follow the instructions in the
Installation guidelines/reducing
section
the effects of metal
System Manual, 06/2019, J31069-D0171-U001-A22-7618
SIMATIC RF600

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