Motorola iDEN i930 Field Service Manual page 108
Basic and field level test procedures
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Also See for iDEN i930:
- User manual (194 pages) ,
- Welcome manual (39 pages) ,
- User manual (178 pages)
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MECHANICAL PARTS REWORK AND REPAIR: REWORK PROCEDURE FOR COMPONENTS UNDER SAME SHIELD OF AN
U801 (Patriot)
See Section BGA Rework/Repair ProcedureBGA Rework/Repair Procedure
Top 330ºC - Bottom 100ºC
OK Ind.: Min. 5 l/min – Max.20 l/min
Pace
Min. 3/4 – Max. 8/9
²Use Traces, Bias and/or Ground edges to aid on X/Y placement.
U802 Flash Memory
See Section BGA Rework/Repair ProcedureBGA Rework/Repair Procedure
Top 330ºC - Bottom 100ºC
OK Ind.: Min. 5 l/min – Max.20 l/min
Pace
Min. 3/4 – Max. 8/9
²Use Traces, Bias and/or Ground edges to aid on X/Y placement.
U803 SRAM
See Section BGA Rework/Repair ProcedureBGA Rework/Repair Procedure
Top 330ºC - Bottom 100ºC
OK Ind.: Min. 5 l/min – Max.20 l/min
Pace
Min. 3/4 – Max. 8/9
²Use Traces, Bias and/or Ground edges to aid on X/Y placement.
9.8
REWORK PROCEDURE FOR COMPONENTS UNDER SAME
SHIELD OF AN UNDER-FILLED IC
9.8.1
Shield Cutting Procedure
68P80401P03-O
ALIGNMENT
²As per Pedro.
ALIGNMENT
²As per Pedro.
ALIGNMENT
²As per Pedro.
N-P20
None
N-P20
Modified "F" over J752 will
prevent degradation.
N-P20
Modified "F" over J752 will
prevent degradation.
9-11
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