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CHAPTER 18
The µ PD789800 Subseries should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
µ µ µ µ PD789800GB-×××
×××-8ES: 44-pin plastic LQFP (10 × × × × 10)
×××
×××
µ µ µ µ PD78F9801GB-8ES:
44-pin plastic LQFP (10 × × × × 10)
Soldering Method
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200 °C or higher),
Count: Twice or less
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
Partial heating method
Pin temperature: 300°C max. Time: 3 seconds max. (per pin row)
Caution Do not use different soldering methods together (except for partial heating).
220
RECOMMENDED SOLDERING CONDITIONS
Table 18-1. Surface Mounting Type Soldering Conditions
Soldering Conditions
User's Manual U12978EJ3V0UD
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
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