HP 54 Basic Cutter User Manual page 28

Most automated tasks are organized from within the cutting software. However, when the same graphic
contour needs to be cut out, the automatic tasks may also involve some manual manipulation.
Before using the automation features, note the amount of your cutter's RAM. If the cutter's RAM is greater
than the job's file size, then the automating features can be used. If the cutter's RAM is less than the job's
file size, the automation features should not be used.
OPOS origin
The parameter OPOS origin was created to automate the start of the OPOS procedure. This parameter has four
settings. Its usage depends on the chosen OPOS mode. It can be found in the system submenu OPOS
parameters. If the OPOS mode is OPOS barcode or OPOS sheet, then OPOS origin has no effect. The useful
combinations are mentioned in the table below.
Mark
XY correction line
Current position
Center of substrate
In combination with OPOS X mode
OPOS origin is set to 'Mark'
●
This is the default setting. On receiving an OPOS job from the computer, the cutter prompts you to set the
tool above the first mark and press
position.
OPOS origin is set to 'Current position'
●
On receiving an OPOS job from the computer, the cutter immediately starts looking for the mark when it
gets an OPOS job from the computer, without waiting for you to move the tool. Therefore, you have to
position the tool above the first mark while loading the substrate.
If OPOS origin is set to either XY correction line or Center of substrate, the cutter reacts as though the
parameter were set to Indicate mark.
Read the HP barcode
Some RIPs can print a barcode together with the OPOS markers. This barcode can then be used to identify the
job and retrieve the cut data automatically from the computer.
The complete procedure is normally started from the computer. The cutting software usually has a button or a
command called Scan a barcode. First make sure the substrate is loaded.
Using the arrows, place the carriage before the HP barcode.
24 Chapter 4 Cut the substrate
OPOS X
Indicate mark
–
Current position
–
. The cutter then starts searching for the OPOS mark around that
ENWW