Huawei MU609 Hardware Manual page 22

Hspa lga module
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HUAWEI MU609 HSPA LGA Module
Hardware Guide
PIN
Pad
Pin Name
No.
Type
-
117
NC
-
118
NC
-
119
NC
-
120
NC
-
121
GND
-
122
GND
-
123
GND
-
124
GND
-
125
GND
-
126
GND
-
127
GND
-
128
GND
-
129
GND
-
130
GND
-
131
GND
-
132
GND
-
133
GND
-
134
GND
Issue 04 (2016-12-12)
Description
Parameter
Not connected,
-
please keep this
pin open
Not connected,
-
please keep this
pin open
Not connected,
-
please keep this
pin open
Not connected,
-
please keep this
pin open
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Thermal Ground
-
Pad
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
Typ.
Min. (V)
Max. (V)
(V)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Comments
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
22

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