Power Interface; Overview - Huawei MU609 Hardware Manual

HUAWEI MU609 HSPA LGA Module
Hardware Guide
PIN Pad
Pin Name
No. Type
-
135 GND
-
136 GND
-
137 GND
-
138 GND
-
139 GND
-
140 GND
-
141 GND
-
142 GND
-
143 GND
-
144 GND
-
145 GND

3.3 Power Interface

3.3.1 Overview

The power supply part of the MU609 module contains:


Issue 04 (2016-12-12)
Description
Thermal Ground
Pad
Thermal Ground
Pad
Thermal Ground
Pad
Thermal Ground
Pad
Thermal Ground
Pad
Thermal Ground
Pad
Thermal Ground
Pad
Thermal Ground
Pad
Thermal Ground
Pad
Thermal Ground
Pad
Thermal Ground
Pad
P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital

signal output. PO indicates power output pins; PI indicates power input pins.
V indicates Low-level Input voltage; V

IL
Low-level Output voltage; V
The NC (Not Connected) pins are floating and there are no signal connected to these pins.

 The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact with us for more details about
this information.
VBAT pins for the power supply
VCC_EXT1 pin for external power output with 1.8 V
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Copyright © Huawei Technologies Co., Ltd.
Description of the Application Interfaces
Parameter Min. (V)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
indicates High-level Input voltage; V
IH
indicates High-level Output voltage.
OH
Typ.
Max. (V) Comments
(V)
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
OL
indicates
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