Huawei MU609 Hardware Manual page 41

Hspa lga module

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HUAWEI MU609 HSPA LGA Module

Hardware Guide

Figure 3-18 Complete structure of the stripline

Figure 3-19 Routing for the RF interface

Please use tools such as Microstrip to calculate RF MAIN pad impedance. the RF

MAIN pad dimension of MU609 is 1.1 mm (L) x 0.9 mm (W). You can get the

impedance with lower the 50 Ω calculated by Microstrip as shown in the following

figure. Yet the target impedance is 50 Ω. The solution is that to increase the thickness

of dielectric material. You need carve out the copper area of the second layer that

projected by the RF MAIN pad at top layer. How many layers should be carved out

depend on the permittivity, track width, and distance from the floor of your own PCB.

Issue 04 (2016-12-12)

Huawei Proprietary and Confidential

Description of the Application Interfaces

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